Abstract: The present invention is directed to a method of fast bitmapping defective memory arrays in semiconductor integrated circuit dice formed on a wafer. The method involves loading a wafer onto automated test equipment. Initial production testing is then performed on each die of the wafer to determine whether the memory arrays of each die are functioning properly. Where a die is found to have at least one defective memory array, the particular memory arrays of the die that contain defect are specifically identified using BIST circuitry forming part of the die. Then selectively performed diagnostic testing is performed on only the failed memory arrays of each defective die to generate memory array defect data. The memory array defect data is used to generate bit maps of the failed memory arrays using the memory array data.