Patents by Inventor Jeff Gasparitsch

Jeff Gasparitsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for controlling leading edge and trailing edge polishing
    Patent number: 6729945
    Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 4, 2004
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Jeff Gasparitsch, Robert Taff, Kenneth J. Bahng, Paul Stasiewicz, Erik H. Engdahl
  • Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
    Patent number: 6645046
    Abstract: A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; contacting the polishing member in the conditioning region with a conditioning member; and conditioning the polishing member. The apparatus includes an end effector adapted to receive a conditioning member, the end effector being attached to an arm that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: November 11, 2003
    Assignee: Lam Research Corporation
    Inventors: Michael Vogtmann, Chris Frederickson, Jeff Gasparitsch, Gene Hempel, Erik Engdahl
  • Apparatus for controlling leading edge and trailing edge polishing
    Publication number: 20020146972
    Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 10, 2002
    Inventors: Cangshan Xu, Jeff Gasparitsch, Robert Taff, Kenneth J. Bahng, Paul Stasiewicz, Erik H. Engdahl