Abstract: Systems and methods for using machine learning to dynamically assess contract parameters are disclosed. According to certain aspects, an electronic device may train a machine learning model using real-world pricing and contract data, access parameters associated with a potential contract for an entity, and analyzing, using the machine learning model, the accessed parameters. Based on the analysis, the machine learning model may output a set of potential terms for the potential contract. Data indicative of this output may be availed to the entity to be used in negotiating and executing the contract, among other uses.

Abstract: Systems and methods for using machine learning to dynamically assess contract parameters are disclosed. According to certain aspects, an electronic device may train a machine learning model using real-world pricing and contract data, access parameters associated with a potential contract for an entity, and analyzing, using the machine learning model, the accessed parameters. Based on the analysis, the machine learning model may output a set of potential terms for the potential contract. Data indicative of this output may be availed to the entity to be used in negotiating and executing the contract, among other uses.

Abstract: An ethanol production facility is provided for processing a plurality of fermentable feedstock materials into an ethanol end product through fermentation and distillation. The facility includes a fermenting stage for converting the plurality of fermentable feedstocks into an alcohol mixture including ethanol and water, and a distillation stage. The distillation stage distills the low concentration alcohol mixture into a high concentration alcohol distillate. A kernel feedstock processing stage is receives and processes a kernel containing feedstock, and includes a receiving station for receiving the kernel containing feedstock. A storage station is provided for storing the kernel based feedstock, and a mill is provided for milling the kernel based feedstock into a flour based feedstock. A conveyor is provided for conveying the milled floor based feedstock to the fermenting stage.

Abstract: An ethanol production facility is provided for processing a plurality of fermentable feedstock materials into an ethanol end product through fermentation and distillation. The facility includes a fermenting stage for converting the plurality of fermentable feedstocks into an alcohol mixture including ethanol and water, and a distillation stage. The distillation stage distills the low concentration alcohol mixture into a high concentration alcohol distillate. A kernel feedstock processing stage is receives and processes a kernel containing feedstock, and includes a receiving station for receiving the kernel containing feedstock. A storage station is provided for storing the kernel based feedstock, and a mill is provided for milling the kernel based feedstock into a flour based feedstock. A conveyor is provided for conveying the milled floor based feedstock to the fermenting stage.

Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al inter-layer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Abstract: A sputter target assembly including a high purity copper sputter target diffusion bonded to a backing plate, preferably composed of either aluminum, aluminum alloy, aluminum matrix composite materials, copper, or copper alloy, and a Ni-alloy interlayer, preferably composed of Ni—V, Ni—Ti, Ni—Cr, or Ni—Si, located between and joining the target and backing plate, and a method for making the assembly. The method of making involves depositing (e.g., electroplating, sputtering, plasma spraying) the interlayer on a mating surface of either the sputter target or backing plate and pressing, such as hot isostatically pressing, the sputter target and backing plate together along mating surfaces so as to form a diffusion bonded sputter target assembly.

Abstract: An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating surface of either the sputter target or the backing plate to form a plurality of salient portions; depositing an intermediate layer comprising nickel on that mating surface; pressing the sputter target and the backing plate together along the mating surfaces so as to disrupt the mating surfaces; and holding the sputter target and the backing plate in contact at a temperature just below the melting points of the sputter target and backing plate materials to promote diffusion bonding. In an especially preferred form of the invention, the mating surface on the harder of the sputter target or the backing plate is roughened by machining a series of concentric grooves.