Patents by Inventor Jeff Ju

Jeff Ju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die package including embedded flip chip
    Patent number: 7768108
    Abstract: A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: August 3, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yong Liu, Jeff Ju, Zhongfa Yuan, Roger Luo
  • SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
    Publication number: 20090230537
    Abstract: A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 17, 2009
    Inventors: Yong Liu, Jeff Ju, Zhongfa Yuan, Roger Luo