Abstract: A laser system and method for inspecting a substrate and/or a laser score formed in a moving web of material during laser processing of the material with a laser processing system having a laser source for generating a laser beam and a lens for focusing the laser beam and reflecting the laser beam onto the advancing web of material where the focal point is directed a selected location on the web to produce the score in the advancing web of material, the score having a depth less than the thickness of the material and measuring the depth at one or more locations on the advancing web of material concurrent with producing the score line and where the material may be a packaging material and the score provided for easy opening of the packaging.