Abstract: Certain exemplary embodiments can provide a system, machine, device, and/or manufacture configured or adapted for, and/or a method for, activities that can comprise and/or relate to a burn guard system configured or adapted to operably prevent burns to the skin of a user of a heated hair curling iron.

Abstract: A method and system for determining a position and orientation of a receiver relative to a transmitter includes transmitted positioning signals having different frequency components that define a common period. One or more of the transmitted positioning signal have identifiable phase characteristics relative to the start of the common period. The positioning signals are received at the receiver. A time point corresponding to the start of the common period is determined from the received positioning signals. The polarities of the received signals can then be determined based on properties of the positioning signals relative to the start of the common period and relative to properties of the transmitted positioning signals. These polarities can be used to track a signed position and uniquely associated orientation of the receiver relative to the transmitter.

Abstract: A method and system for determining a position and orientation of a receiver relative to a transmitter includes transmitted positioning signals having different frequency components that define a common period. One or more of the transmitted positioning signal have identifiable phase characteristics relative to the start of the common period. The positioning signals are received at the receiver. A time point corresponding to the start of the common period is determined from the received positioning signals. The polarities of the received signals can then be determined based on properties of the positioning signals relative to the start of the common period and relative to properties of the transmitted positioning signals. These polarities can be used to track a signed position and uniquely associated orientation of the receiver relative to the transmitter.

Abstract: A batch process for the high-pressure forming of metal plugs in the dielectric layers of semiconductor wafers. After holes are etched in the dielectric layer of each wafer, and a layer of a metal such as aluminum deposited over the dielectric, both the etching and the deposition being done in vacuum chamber cluster machines, the wafers are removed from the cluster machines and placed together in a high pressure chamber where they are subjected to high isostatic pressure that forces the metal into the holes.

Abstract: An improved method for depositing a flow fill layer of an integrated circuit. Two flowlayers and two cap layers are deposited. The wafer is warmed between the deposition of the first cap layer and the deposition of the second flowlayer, to evaporate water from the first flowlayer. Preferably, each of the cap layers is deposited in two separate steps of plasma enhanced chemical vapor deposition, to inhibit crack formation in the flowlayers. Most preferably, after the depositions of each flowlayer, the flowlayer is planarized by flowing H.sub.2 O.sub.2 thereupon.

Abstract: A batch process for the high-pressure forming of metal plugs in the dielectric layers of semiconductor wafers. After holes are etched in the dielectric layer of each wafer, and a layer of a metal such as aluminum deposited over the dielectric, both the etching and the deposition being done in vacuum chamber cluster machines, the wafers are removed from the cluster machines and placed together in a high pressure chamber where they are subjected to high isostatic pressure that forces the metal into the holes.

Abstract: An improved method for depositing the cap layer of a flow fill layer of an integrated circuit. The cap layer is deposited in at least two steps, instead of all at once.