Abstract: A radio frequency (RF) power divider includes an input port, an internal node, and two output ports. The RF power divider also includes a lumped element divider circuit that links the internal node to the two output ports. This divider circuit includes two branch circuits, each including an inductor that connects the internal node to one of the output ports. Additionally, the RF power divider further includes an isolation circuit positioned between the two output ports, which includes a resistor. An impedance matching circuit connects the input port to the internal node. This impedance matching circuit is configured to selectively transmit or dissipate signal energy within a predetermined frequency band received from the input port, ensuring efficient power transfer and reduced signal reflection.

Abstract: Microwave packaging uses signal vias and interposers, such as metal lead frame interposers. For example, the microwave circuit die includes signal vias that electrically connect the top side and the bottom side of the die. Microwave signal circuitry on the die have signal paths that are electrically connected to the top side of the signal vias. The microwave signal circuitry typically may have an operating frequency of 300 MHz or faster. The bottom side of the signal vias are electrically connected to corresponding areas on the top side of the interposer. The bottom side of the die may also include a ground plane, with ground vias that electrically connect the top side of the die to the ground plane.

Abstract: Microwave packaging uses signal vias and interposers, such as metal lead frame interposers. For example, the microwave circuit die includes signal vias that electrically connect the top side and the bottom side of the die. Microwave signal circuitry on the die have signal paths that are electrically connected to the top side of the signal vias. The microwave signal circuitry typically may have an operating frequency of 300 MHz or faster. The bottom side of the signal vias are electrically connected to corresponding areas on the top side of the interposer. The bottom side of the die may also include a ground plane, with ground vias that electrically connect the top side of the die to the ground plane.