Patents by Inventor Jeff McFadden
Jeff McFadden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150296608Abstract: An RFID shield in the form of a thin plastic substrate upon which a shielding pattern is printed in conductive paint or ink. The pattern may cover the entire surface of the substrate or it may be in the form of intersecting lines or arrays of intersecting elements.Type: ApplicationFiled: April 10, 2015Publication date: October 15, 2015Applicant: MOBILE DYNAMIC MARKETING, INC.Inventors: Jeff MCFADDEN, Brian P. MCFADDEN, Bruce V. MUTTER, Heather N. WILLIAMS, John S. BROWNING, JR.
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Patent number: 7968012Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.Type: GrantFiled: March 7, 2008Date of Patent: June 28, 2011Assignee: Laird Technologies, Inc.Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
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Publication number: 20080283186Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.Type: ApplicationFiled: March 7, 2008Publication date: November 20, 2008Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
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Patent number: 6873031Abstract: A shielding device is provided in which a layer of deformable electrically conductive material is conformed to fit over the components on the board. In one embodiment of the invention the deformable material is conductive foam, such as metalized foam. One or both sides of the foam layer can be covered with dielectric material. Portions of the dielectric material and foam can be removed, such as from the bottom layer to create insulating slants over the components. Cuts in the deformable material lead to compression only over the component. The board can be placed over the components, which are received in recesses in the shield which are either preformed or result from compression of the deformable material at the location of the components. In one embodiment of the invention, regions of conductive layer are removed and the layer is placed over the components. A top layer is placed thereover. The invention also relates to the method of foaming the board level shield.Type: GrantFiled: March 4, 2002Date of Patent: March 29, 2005Assignee: Laird Technologies, Inc.Inventors: Jeff McFadden, Michael Lambert
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Patent number: 6870092Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: GrantFiled: December 4, 2002Date of Patent: March 22, 2005Assignee: Laird Technologies, Inc.Inventors: Michael Lambert, Jeff McFadden, Philip van Haaster
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Publication number: 20040020674Abstract: Electrically conductive materials can be used to shield EMI, whereas energy-absorptive materials can be used to suppress EMI. Disclosed are systems and processes for combining electrically conductive and absorptive materials to improve EMI shielding effectiveness. In one embodiment, an absorptive material is combined with the conducting material forming a composite. In another embodiment, absorptive material is combined with electrically conductive material and selectively applied to a substrate, such as a plastic enclosure, to suppress EMI incident upon the substrate, thereby reducing the susceptibility of electronics contained within across a broad frequency range.Type: ApplicationFiled: June 13, 2003Publication date: February 5, 2004Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Jeff McFadden, Martin Rapp
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Patent number: 6652777Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.Type: GrantFiled: February 28, 2001Date of Patent: November 25, 2003Assignee: Amesbury Group, Inc.Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
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Publication number: 20030192715Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: ApplicationFiled: December 4, 2002Publication date: October 16, 2003Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Michael Lambert, Jeff McFadden, Philip van Haaster
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Patent number: 6384326Abstract: A cable shield and method of formation, more specifically, a closure including an adhesive strip on two surfaces, which is dry to the touch and which will adhere to the complementary adhesive strip, but substantially nothing else.Type: GrantFiled: September 5, 2000Date of Patent: May 7, 2002Assignee: Laird Technologies, Inc.Inventors: Jeff McFadden, Richard Thibeau
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Publication number: 20010028558Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.Type: ApplicationFiled: February 28, 2001Publication date: October 11, 2001Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
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Patent number: RE41594Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: GrantFiled: September 5, 2006Date of Patent: August 31, 2010Assignee: Laird Technologies, Inc.Inventors: Michael Lambert, Jeff McFadden, Philip van Haaster
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Patent number: RE42512Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: GrantFiled: November 10, 2008Date of Patent: July 5, 2011Assignee: Laird Technologies, Inc.Inventors: Michael R. Lambert, Jeff McFadden, Philip van Haaster