Patents by Inventor Jeff Parrell

Jeff Parrell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160178495
    Abstract: A device and method for use as an adjunct in assuring that a manufactured wire is substantially free of internal flaws. A plurality of successively adjacent wire bending stations are provided, where each station includes means for bending the wire into bending planes which are different for each of the stations. The wire is passed through the successive stations, whereby the different bending planes at each station subject the wire at each station to tensile bending strain at portions of the wire cross-section which are different for each station. As a result the probability is increased that a given internal flaw in the wire will be exposed to the tensile bending strain condition as the wire passes through the successive stations, increasing likelihood of breakage of the wire at the flaw or of flaw magnification to improve detection of the flaw during subsequent wire inspections.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 23, 2016
    Inventors: Jeff Parrell, Bleslaw Czabaj, Youzhu Zhang, Seungok Hong
  • Patent number: 8943681
    Abstract: A device for use as an adjunct in assuring that a manufactured wire is substantially free of internal flaws. A plurality of successively adjacent wire bending stations are provided, where each station includes means for bending the wire into bending planes which are different for each of the stations. The wire is passed through the successive stations, whereby the different bending planes at each station subject the wire at each station to tensile bending strain at portions of the wire cross-section which are different for each station. As a result the probability is increased that a given internal flaw in the wire will be exposed to the tensile bending strain condition as the wire passes through the successive stations, increasing likelihood of breakage of the wire at the flaw or of flaw magnification to improve detection of the flaw during subsequent wire inspections.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: February 3, 2015
    Assignee: Oxford Superconducting Technology
    Inventors: Jeff Parrell, Boleslaw Czabai, Youzhu Zhang, Seungok Hong, Michael Field
  • Publication number: 20100101076
    Abstract: A device and method for use as an adjunct in assuring that a manufactured wire is substantially free of internal flaws. A plurality of successively adjacent wire bending stations are provided, where each station includes means for bending the wire into bending planes which are different for each of the stations. The wire is passed through the successive stations, whereby the different bending planes at each station subject the wire at each station to tensile bending strain at portions of the wire cross-section which are different for each station. As a result the probability is increased that a given internal flaw in the wire will be exposed to the tensile bending strain condition as the wire passes through the successive stations, increasing likelihood of breakage of the wire at the flaw or of flaw magnification to improve detection of the flaw during subsequent wire inspections.
    Type: Application
    Filed: May 21, 2007
    Publication date: April 29, 2010
    Inventors: Jeff Parrell, Boleslaw Czabai, Youzhu Zhang, Seungok Hong, Michael Field
  • Patent number: 7585377
    Abstract: Critical current densities of internal tin wire having values of at least 2000 A/mm2 at temperature of 4.2 K and in magnetic field of 12 T are achieved by controlling the following parameters in a distributed barrier subelement design: wt % Sn in bronze; atomic Nb:Sn; local area ratio; reactable barrier; and barrier thickness relative to the filament thickness; and the design for restacking and wire reduction to control the maximum filament diameter at the subsequent heat reaction stage.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: September 8, 2009
    Assignee: Oxford Superconducting Technology
    Inventors: Michael Field, Jeff Parrell, Youzhu Zhang, Seungok Hong
  • Patent number: 7562433
    Abstract: A method for fabrication of nanometer scale metal fibers, followed by optional further processing into cables, yarns and textiles composed of the primary nanofibers. A multicomponent composite is first formed by drilling a billet of matrix metal, and inserting rods of the metal desired as nanofibers. Hexed or round rods can also be inserted into a matrix metal can. The diameter of this composite is then reduced by mechanical deformation methods. This composite is then cut to shorter lengths and reinserted into another billet of matrix metal, and again the diameter is reduced by mechanical deformation. This process of large scale metal stacking followed by mechanical deformation is repeated until the desired fiber size scale is reached, the fibers being contained in the matrix metal. After size reduction, the composite metal wires may be further processed into built up configurations, depending on intended application, by stranding, cabling, braiding, weaving, knitting, felting, etc.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: July 21, 2009
    Assignee: Oxford Superconducting Technology
    Inventors: Seung Hong, William G. Marancik, Jeff Parrell, Michael Field, Kenneth Marken, Youzhu Zhang
  • Publication number: 20080274903
    Abstract: Critical current densities of internal tin wire having values of at least 2000 at temperature of 4.2 K and in magnetic field of 12 T are achieved by controlling the following parameters in a distributed barrier subelement design: wt % Sn in bronze; atomic Nb:Sn; local area ratio; reactable barrier; and barrier thickness relative to the filament thickness; and the design for restacking and wire reduction to control the maximum filament diameter at the subsequent heat reaction stage.
    Type: Application
    Filed: March 4, 2008
    Publication date: November 6, 2008
    Inventors: Michael Field, Jeff Parrell, Youzhu Zhang, Seungok Hong
  • Publication number: 20080163474
    Abstract: A method for the fabrication of an insulated solder bonded multifilamentary superconducting wire composite. An uninsulated wire composite is prepared by using a high melting point solder to join a multifilamentary superconducting composite to a solderable metallic component. A polymer insulation film coating is then applied on top of the wire composite, and the resulting assembly is subjected to heating in a furnace at furnace temperatures and for a period sufficient to cure the insulation but insufficient to melt the solder.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 10, 2008
    Inventors: Seung Hong, Maarten Meinesz, Youzhu Zhang, Jeff Parrell, Michael Field
  • Patent number: 7368021
    Abstract: Critical current densities of internal tin wire to the range of 3000 A/mm2 at temperature of 4.2 K and in magnetic field 12 T are achieved by controlling the following parameters in a distributed barrier subelement design: wt % Sn in bronze; atomic Nb:Sn; local area ratio; reactable barrier; barrier thickness relative to the filament thickness; additions of a dopant such as Ti or Ta to the Nb3Sn; and the design for restacking and wire reduction to control the maximum filament diameter at the subsequent heat reaction stage.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: May 6, 2008
    Assignee: Oxford Superconducting Technology
    Inventors: Michael Field, Jeff Parrell, Youzhu Zhang, Seungok Hong
  • Publication number: 20070234545
    Abstract: A method for fabrication of nanometer scale metal fibers, followed by optional further processing into cables, yarns and textiles composed of the primary nanofibers. A multicomponent composite is first formed by drilling a billet of matrix metal, and inserting rods of the metal desired as nanofibers. Hexed or round rods can also be inserted into a matrix metal can. The diameter of this composite is then reduced by mechanical deformation methods. This composite is then cut to shorter lengths and reinserted into another billet of matrix metal, and again the diameter is reduced by mechanical deformation. This process of large scale metal stacking followed by mechanical deformation is repeated until the desired fiber size scale is reached, the fibers being contained in the matrix metal. After size reduction, the composite metal wires may be further processed into built up configurations, depending on intended application, by stranding, cabling, braiding, weaving, knitting, felting, etc.
    Type: Application
    Filed: September 26, 2005
    Publication date: October 11, 2007
    Inventors: Seung Hong, William Marancik, Jeff Parrell, Michael Field, Kenneth Marken, Youzhu Zhang
  • Patent number: 7216418
    Abstract: A method for decreasing the effective magnetic filament sizes for high current internal tin Nb3Sn superconductors. During processing composite rods preferably comprised of copper clad Ta rods of approximately the same dimensions as the hexes in the designed filament billet stack are used as dividers in the subelement. Along with the Ta rods, Ta strips are strategically situated against the Nb or Nb alloy barrier tube which surrounds the subelement. The use of Ta as a spacer instead of copper prevents any reasonable likelihood of bridging of the superconducting phases formed after final reaction.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: May 15, 2007
    Assignee: Oxford Superconducting Technology
    Inventors: Seung Hong, Jeff Parrell, Youzhu Zhang, Michael Field
  • Patent number: 7089647
    Abstract: A method for increasing the copper to superconductor ratio of a superconductor core wire by forming a copper-based strip about the core wire which at least partially encloses the core wire in contact therewith by deforming the strip longitudinally into a U shape nested about the wire; and soldering the wire and strip in the assembly of step (a) to form a strong mechanical, electrical and thermal bond therebetween.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: August 15, 2006
    Assignee: Oxford Superconducting Technology
    Inventors: Robert Hentges, Jeff Parrell, William G. Marancik, Seung Hong
  • Publication number: 20060081307
    Abstract: Critical current densities of internal tin wire to the range of 3000 A/mm2 at temperature of 4.2 K and in magnetic field 12 T are achieved by controlling the following parameters in a distributed barrier subelement design: wt % Sn in bronze; atomic Nb:Sn; local area ratio; reactable barrier; barrier thickness relative to the filament thickness; additions of a dopant such as Ti or Ta to the Nb3Sn; and the design for restacking and wire reduction to control the maximum filament diameter at the subsequent heat reaction stage.
    Type: Application
    Filed: February 22, 2005
    Publication date: April 20, 2006
    Inventors: Michael Field, Jeff Parrell, Youzhu Zhang, Seungok Hong
  • Publication number: 20060032042
    Abstract: A method for decreasing the effective magnetic filament sizes for high current internal tin Nb3Sn superconductors. During processing composite rods preferably comprised of copper clad Ta rods of approximately the same dimensions as the hexes in the designed filament billet stack are used as dividers in the subelement. Along with the Ta rods, Ta strips are strategically situated against the Nb or Nb alloy barrier tube which surrounds the subelement. The use of Ta as a spacer instead of copper prevents any reasonable likelihood of bridging of the superconducting phases formed after final reaction.
    Type: Application
    Filed: October 22, 2004
    Publication date: February 16, 2006
    Inventors: Seung Hong, Jeff Parrell, Youzhu Zhang, Michael Field
  • Patent number: 6981309
    Abstract: An improvement is disclosed in the method for producing a multifilament (Nb, Ti)3Sn superconducting wire by the steps of preparing a plurality of Nb or Nb alloy rods where Nb or Nb alloy monofilaments are encased in copper or copper alloy sheaths; packing the Nb or Nb alloy rods within a copper containing matrix to form a packed subelement for the superconducting wire; providing sources of Sn, and sources of Ti within said subelement; assembling the subelements within a further copper containing matrix; and diffusing the Sn and Ti into the Nb or Nb alloy rods to form (Nb, Ti)3Sn. The method is improved by diffusing the Ti into the Nb from a minor number of Ti dopant source rods which are distributed among the Nb or Nb alloy rods.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: January 3, 2006
    Assignee: Oxford Superconducting Technology
    Inventors: Seung Hong, Jeff Parrell, Michael Field
  • Publication number: 20050178472
    Abstract: An improvement is disclosed in the method for producing a multifilament (Nb, Ti)3 Sn superconducting wire by the steps of preparing a plurality of Nb or Nb alloy rods where Nb or Nb alloy monofilaments are encased in copper or copper alloy sheaths; packing the Nb or Nb alloy rods within a copper containing matrix to form a packed subelement for the superconducting wire; providing sources of Sn, and sources of Ti within said subelement; assembling the subelements within a further copper containing matrix; and diffusing the Sn and Ti into the Nb or Nb alloy rods to form (Nb, Ti)3 Sn. The method is improved by diffusing the Ti into the Nb from a minor number of Ti dopant source rods which are distributed among the Nb or Nb alloy rods.
    Type: Application
    Filed: October 13, 2004
    Publication date: August 18, 2005
    Inventors: Seung Hong, Jeff Parrell, Michael Field
  • Publication number: 20040226163
    Abstract: A method for increasing the copper to superconductor ratio of a superconductor core wire by forming a copper-based strip about the core wire which at least partially encloses the core wire in contact therewith by deforming the strip longitudinally into a U shape nested about the wire; and soldering the wire and strip in the assembly of step (a) to form a strong mechanical, electrical and thermal bond therebetween.
    Type: Application
    Filed: February 19, 2004
    Publication date: November 18, 2004
    Inventors: Robert Hentges, Jeff Parrell, William G. Marancik, Seung Hong