Patents by Inventor Jeff Qin

Jeff Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11922700
    Abstract: A method and apparatus for aiding a police officer in writing a report by creating a depiction of an incident scene is provided herein. During operation a drone will photograph an incident scene from above. Relevant objects will be identified and a depiction of the incident scene will be created by overlaying the relevant photographed real world objects onto a map retrieved from storage. The depiction of the incident scene will be made available to police officers to increase the officers' efficiency in report writing. More particularly, officers will no longer need to re-create the depiction of the incident scene by hand. Instead, the officer will be able to use the depiction of the incident scene.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: March 5, 2024
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Bing Qin Lim, Janet A Manzanares, Jeff Talbot, Maryam Eneim, Todd M Conklin, Jami Perkins, Jon Milan
  • Patent number: 9415619
    Abstract: Systems and methods for decoratively coating a substrate are disclosed wherein the ink is diffused into the substrate, as opposed to onto the substrate. Substrates are able to comprise metals, plastics, bamboo, wood, glass, and metals wherein such materials can also be pre-coated. A system for transferring a decorative image to a substrate comprises a chamber configured to receive a substrate, a means for securing a transfer medium containing the decorative image to be transferred, an optional vacuum source coupled to the chamber, and a heat source removably coupled to the chamber. The transfer is positioned face down onto a surface of the substrate, secured into position. The vacuum source may be used to evacuate the chamber to more tightly pull the transfer medium to the substrate. Then the substrate and transfer are heated, and the transfer medium ink diffuses into the substrate, thereby diffusing the image into the substrate.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: August 16, 2016
    Assignee: FLEXTRONICS AP, LLC
    Inventors: Suriaprakash Narotamo, Charles Raymon Hill, Jeff Qin, Zhong Wang
  • Patent number: 9283698
    Abstract: A method for manufacturing a component including a bi-metallic sheet includes performing a manufacturing process that heats the bi-metallic sheet and physically constraining the bi-metallic sheet from deformation during the cooling of the bi-metallic sheet. Optionally, the method additionally includes physically constraining the bi-metallic sheet from deformation during the manufacturing process that heats the bi-metallic sheet. A constraining apparatus is also disclosed and includes a first constraining component having a first thermally conductive contact surface adapted to abut a first surface of a metal sheet, a second constraining component having a second contact surface adapted to abut a second surface of the metal sheet, and an engaging device operative to fix the first constraining component and the second constraining component in position relative to one another. The metal sheet is constrained between the first contact surface and the second contact surface during heating and/or cooling.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: March 15, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Dongji Xie, Jichen (Jeff) Qin
  • Patent number: 8681485
    Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 25, 2014
    Assignee: Flextronics AP, LLC
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin, Wu Bing (Levin) Li, Suriaprakash Narotamo
  • Patent number: 8552292
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Jeff Qin, Charles R. Hill, Suriaprakash Narotamo, Levin Li, Spring Wu, Zhong Wang
  • Publication number: 20110250377
    Abstract: A plastic-metal hybrid part includes an anodized metal substrate having plastic structures formed on the metal substrate. In a particular embodiment, the metal hybrid part is an electronic device enclosure and plastic structures are mounting features formed on the enclosure. Methods for manufacturing the plastic-metal hybrid part are also disclosed. In a particular embodiment, the metal substrate undergoes a pretreatment, is anodized after the pretreatment, and the plastic structures are molded directly on the anodized exterior surface of the metal substrate. In another embodiment, the anodized metal substrate is primed with a coupling agent before the plastic features are formed thereon.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 13, 2011
    Inventor: Jichen (Jeff) Qin
  • Publication number: 20110239725
    Abstract: A method for manufacturing a component including a bi-metallic sheet includes performing a manufacturing process that heats the bi-metallic sheet and physically constraining the bi-metallic sheet from deformation during the cooling of the bi-metallic sheet. Optionally, the method additionally includes physically constraining the bi-metallic sheet from deformation during the manufacturing process that heats the bi-metallic sheet. A constraining apparatus is also disclosed and includes a first constraining component having a first thermally conductive contact surface adapted to abut a first surface of a metal sheet, a second constraining component having a second contact surface adapted to abut a second surface of the metal sheet, and an engaging device operative to fix the first constraining component and the second constraining component in position relative to one another. The metal sheet is constrained between the first contact surface and the second contact surface during heating and/or cooling.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 6, 2011
    Inventors: Shouzhong (Alex) DU, Richard Dale Michonski, Dongji Xie, Jichen (Jeff) Qin
  • Publication number: 20110186455
    Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.
    Type: Application
    Filed: December 22, 2010
    Publication date: August 4, 2011
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin, Wu Bing (Levin) Li, Suriaprakash Narotamo
  • Publication number: 20110180294
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Application
    Filed: December 13, 2010
    Publication date: July 28, 2011
    Inventors: Jichen (Jeff) Qin, Charles R. Hill, Suriaprakash Narotamo, Wu Bing (Levin) Li, Spring Wu, Zhong Wang
  • Publication number: 20110132529
    Abstract: Systems and methods for decoratively coating a substrate are disclosed wherein the ink is diffused into the substrate, as opposed to onto the substrate. Substrates are able to comprise metals, plastics, bamboo, wood, glass, and metals wherein such materials can also be pre-coated. A system for transferring a decorative image to a substrate comprises a chamber configured to receive a substrate, a means for securing a transfer medium containing the decorative image to be transferred, an optional vacuum source coupled to the chamber, and a heat source removably coupled to the chamber. The transfer is positioned face down onto a surface of the substrate, secured into position. The vacuum source may be used to evacuate the chamber to more tightly pull the transfer medium to the substrate. Then the substrate and transfer are heated, and the transfer medium ink diffuses into the substrate, thereby diffusing the image into the substrate.
    Type: Application
    Filed: July 21, 2010
    Publication date: June 9, 2011
    Applicant: FLEXTRONICS, AP, LLC
    Inventors: Suriaprakash Narotamo, Charles Raymon Hill, Jeff Qin, Zhong Wang