Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel to thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel to thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.

Abstract: Apparatus and methods are provided to enable circuit configuration of a substrate by the setting of settable bits associated with those circuits. An electrically conductive material is deposited onto selected settable bits which closes the desired circuit between the settable bits. In one embodiment in accordance with the invention, a carrier substrate is provided that comprises settable bits which are used to control a microelectronic package's electrical characteristics. In one embodiment, the settable bits are in the form of sets of spaced-apart bit pads which form an open circuit between a logic circuit and electrical ground (Vss). The open circuit is closed with the application of electrically conductive material that bridges the set of spaced-apart bit pads. The settable bits, therefore, do not require the addition of high profile components such as 0-ohm resisters to form the electrical bridging function between the bit pads of a settable bit.

Abstract: A micro tool alignment apparatus and method of use is described herein. The micro tool alignment apparatus coarsely aligns multiple imprinting micro tools to one another and includes a plurality of attachment features to facilitate attachment of the micro tool(s) to the alignment apparatus and to facilitate positioning of the micro tool(s) according to a first and a second degree of freedom. Alignment features associated with the micro tool alignment apparatus further facilitate positioning of the micro tool according to a third degree of freedom.

Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.

Abstract: Apparatus and methods are provided to enable circuit configuration of a substrate by the setting of settable bits associated with those circuits. An electrically conductive material is deposited onto selected settable bits which closes the desired circuit between the settable bits. In one embodiment in accordance with the invention, a carrier substrate is provided that comprises settable bits which are used to control a microelectronic package's electrical characteristics. In one embodiment, the settable bits are in the form of sets of spaced-apart bit pads which form an open circuit between a logic circuit and electrical ground (Vss). The open circuit is closed with the application of electrically conductive material that bridges the set of spaced-apart bit pads. The settable bits, therefore, do not require the addition of high profile components such as 0-ohm resisters to form the electrical bridging function between the bit pads of a settable bit.