Patents by Inventor Jeff Reeder

Jeff Reeder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transfer mold semiconductor packaging processes
    Patent number: 7384805
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: June 10, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • Transfer mold semiconductor packaging processes
    Patent number: 7148083
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: December 12, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • Circuit substrates, semiconductor packages, and ball grid arrays
    Patent number: 7095115
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: August 22, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays
    Publication number: 20050101061
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Application
    Filed: November 10, 2004
    Publication date: May 12, 2005
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • Circuit substrates, semiconductor packages, and ball grid arrays
    Publication number: 20040097011
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Application
    Filed: July 2, 2003
    Publication date: May 20, 2004
    Applicant: Micron Technology, Inc.
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • CIRCUIT SUBSTRATES, SEMICONDUCTOR PACKAGES, AND BALL GRID ARRAYS
    Publication number: 20030205828
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Application
    Filed: April 4, 2001
    Publication date: November 6, 2003
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • Transfer mold semiconductor packaging processes
    Publication number: 20030104657
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Application
    Filed: November 1, 2002
    Publication date: June 5, 2003
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
  • Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays
    Publication number: 20020145208
    Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
    Type: Application
    Filed: April 5, 2001
    Publication date: October 10, 2002
    Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder