Patents by Inventor Jeff Strang

Jeff Strang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power electronic module with enhanced thermal and electrical performance
    Patent number: 11894352
    Abstract: A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: February 6, 2024
    Assignee: Renesas Electronics America Inc.
    Inventors: Sri Ganesh A Tharumalingam, Mark Kwoka, Viresh Piyush Patel, Peter Zhizheng Liu, Jeff Strang
  • POWER ELECTRONIC MODULE WITH ENHANCED THERMAL AND ELECTRICAL PERFORMANCE
    Publication number: 20220375909
    Abstract: A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 24, 2022
    Applicant: Renesas Electronics America Inc.
    Inventors: Sri Ganesh A Tharumalingam, Mark Kwoka, Viresh Piyush Patel, Peter Zhizheng Liu, Jeff Strang