Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first well region and a second well region in a substrate. The method includes forming a third well region in the substrate and between the first well region and the second well region. The method includes forming a deep well region in the substrate and under the first well region and the third well region. The method includes partially removing the substrate to form a first fin, a second fin, and a third fin in the first well region, the second well region, and the third well region respectively. The method includes forming a first epitaxial structure, a second epitaxial structure, and a third epitaxial structure in the first recess, the second recess, and the third recess respectively.

Abstract: A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Abstract: A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.

Abstract: A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Abstract: A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Abstract: A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Abstract: A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.

Abstract: A plasma apparatus having a chamber, a set of arc electrodes and a substrate holder is provided. The set of arc electrodes disposed within the chamber has an anode and a cathode, wherein an arc forming space is formed between the anode and the cathode. The anode and the cathode respectively have a crystallized silicon target. The crystallized silicon target of the anode is disposed on an end facing to that of the cathode, wherein the resistance of the crystallized silicon targets is smaller than 0.01 ?·cm. The substrate holder is disposed within the chamber and has a carrying surface, wherein the carrying surface is face to the arc forming space. Besides, a method of fabricating nano-crystalline silicon thin film is also provided. By using the plasma apparatus, a nano-crystalline silicon thin film with high quality is formed.

Abstract: An auto-grounding circuit responsive to a reset signal discharges an input terminal of an integrated circuit and its associated input line to ground, using a pull-down transistor coupled to the input line, with a gate of the pull-down transistor coupled to receive the reset signal. An exemplary circuit also includes a NAND gate and a second pull-down transistor to maintain an established voltage level of the input line after the reset signal is no longer asserted until the input terminal is driven by an applied input signal. The voltage maintaining circuitry is weaker than the main pull-down transistor to avoid interfering with normal operation of the input terminal.

Abstract: A shift register device includes transistor pass gates and latches connected in series and disposed along a data bit line, each latch connected to a corresponding transistor pass gate. Each transistor pass gate is controlled by a separate control signal input line that a provides a signal to the transistor pass gate connected to it. The signals are provided in a staggered time pattern beginning with a latch disposed last in succession, shifting data from one position to the next succeeding position. Each latch is capable of storing one bit of data. The shift register utilizes less silicon space while reducing the amount of power consumed during operation.

Abstract: An adhesive tape feeding apparatus includes a base, an adjustment unit, and a push unit. A tape roll is disposed rotatably on a rear end portion of the base. When a motor is activated, a free end portion of the tape roll is fed from a front end portion of the base by means of a feeding roller set. The free end portion of the tape roll can be forced to press against a blade under tension, which is fixed on the base, so as to be cut by the blade, thereby moving a push unit to press a follower arm of the adjustment unit against a microswitch. Then, the microswitch activates the motor to rotate a cam wheel in such a manner that the cam wheel presses the follower arm against the microswitch. The cam wheel has an outer periphery which is shaped so as to release the follower arm automatically from the cam wheel and the push unit after the cam wheel rotates by a predetermined angle, thereby feeding a predetermined length of the tape roll, which can be changed by adjusting the adjustment unit.

Abstract: A paper shredder includes a casing, an impelling roller, and a clutch mechanism. The casing has a pair of shredding rollers mounted rotatably therein. The impelling roller is disposed rotatably below and is adjacent to the shredding rollers. The clutch mechanism is provided for connection of the shredding rollers and the impelling roller to transmit rotation of the shredding rollers to the impelling roller, and for disconnection of the shredding rollers and the impelling roller when an external force is exerted on the impelling roller to slow down the impelling roller with respect to the shredding rollers.

Abstract: A dual function paper shredder includes a housing having first and second paper inlets, and an interior chamber. A strip forming cutter and a shredding cutter are received inside the chamber and are adapted for cutting paper sheets. The strip forming cutter and the shredding cutter are driven by a driving unit which includes a motor and a gear mechanism. A safety cover is pivotally mounted on the housing for turning between a first position for covering one of the first and second paper inlets, and a second position for covering the other one of the first and second paper inlets.