Patents by Inventor Jeff Upton

Jeff Upton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoforming with precision in-lay
    Patent number: 10293541
    Abstract: A thermoforming in-lay technique is discussed that uses retractable pins to hold an in-lay piece securely in place in a primary mold. The in-lay piece is fabricated prior to the primary molding process and creates multiple pin receivers in the in-lay that are retractably engaged by the retractable pins when placed into the primary mold. When the primary substrate is formed into the primary mold, the retractable pins prevent the in-lay piece from moving out of position. Once the primary substrate has cooled sufficiently, the pins are retracted allowing the finished primary carrier art to be removed from the primary mold.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: May 21, 2019
    Assignee: Specialty Manufacturing Inc.
    Inventors: Jeff Upton, Haydn Forward, Frank Ames, Jr.
  • THERMOFORMING WITH PRECISION IN-LAY
    Publication number: 20170157835
    Abstract: A thermoforming in-lay technique is discussed that uses retractable pins to hold an in-lay piece securely in place in a primary mold. The in-lay piece is fabricated prior to the primary molding process and creates multiple pin receivers in the in-lay that are retractably engaged by the retractable pins when placed into the primary mold. When the primary substrate is formed into the primary mold, the retractable pins prevent the in-lay piece from moving out of position. Once the primary substrate has cooled sufficiently, the pins are retracted allowing the finished primary carrier art to be removed from the primary mold.
    Type: Application
    Filed: February 21, 2017
    Publication date: June 8, 2017
    Inventors: Jeff Upton, Haydn Forward, Frank Ames
  • Thermoforming with precision in-lay
    Patent number: 9610726
    Abstract: A thermoforming in-lay technique is discussed that uses retractable pins to hold an in-lay piece securely in place in a primary mold. The in-lay piece is fabricated prior to the primary molding process and creates multiple pin receivers in the in-lay that are retractably engaged by the retractable pins when placed into the primary mold. When the primary substrate is formed into the primary mold, the retractable pins prevent the in-lay piece from moving out of position. Once the primary substrate has cooled sufficiently, the pins are retracted allowing the finished primary carrier art to be removed from the primary mold.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: April 4, 2017
    Assignee: Specialty Manufacturing Inc.
    Inventors: Jeff Upton, Haydn Forward, Frank Ames, Jr.