Abstract: A packaged integrated circuit device and a circuit board assembly are disclosed that include a semiconductor die and a package substrate that includes a first grid array of contact pads that are electrically coupled to corresponding contact pads on the semiconductor die. The first grid array of contact pads includes a first set of adjacent rows or columns of contact pads that are coupled to a first channel that extends within a ground plane of the package substrate. The first grid array of contact pads includes a second set of adjacent rows or columns of contact pads that are electrically coupled to a second channel that extends within a power plane of the package substrate. The contact pads in the first set of adjacent rows or columns of contact pads directly overlie a portion of the first channel and the contact pads in the second set of adjacent rows or columns of contact pads directly overlie a portion of the second channel.

Abstract: A package assembly (18) that is selectively coupled to a burn-in apparatus (228P) during a burn-in process includes a pin-out (20) having an array of contacts (22) including a set of first contacts (222F) and a set of second contacts (222S). The first contacts (222F) are required for the burn-in process, and are each adapted to be in contact with a corresponding contact member (232P) of the burn-in apparatus (228P) during the burn-in process. The second contacts (222S) are not required for the burn-in process. The second contacts (222S) do not contact any of the contact members (232P) during the burn-in process. The contact members (232P) are arranged at a first pitch. In various embodiments, the array of contacts (22) is arranged at a second pitch that is smaller than the first pitch.

Abstract: A package assembly (18) that is selectively coupled to a burn-in apparatus (228P) during a burn-in process includes a pin-out (20) having an array of contacts (22) including a set of first contacts (222F) and a set of second contacts (222S). The first contacts (222F) are required for the burn-in process, and are each adapted to be in contact with a corresponding contact member (232P) of the burn-in apparatus (228P) during the burn-in process. The second contacts (222S) are not required for the burn-in process. The second contacts (222S) do not contact any of the contact members (232P) during the burn-in process. The contact members (232P) are arranged at a first pitch. In various embodiments, the array of contacts (22) is arranged at a second pitch that is smaller than the first pitch.