Abstract: A method of topside only dual-side testing of an electronic assembly includes providing a singulated through substrate via (TSV) die flip chip attached to a die support including a package substrate. The TSVs on the TSV die extend from its frontside to contactable TSV tips on its bottomside. The TSVs on the frontside of the TSV die are coupled to embedded topside substrate pads on a top surface of the ML substrate. The die support includes lateral coupling paths between at least a portion of the embedded topside substrate pads and lateral topside pads on a topside surface of the die support lateral to the die area. The contactable TSV tips are contacted with probes to provide a first topside connection to the TSVs, and the lateral topside pads are contacted with probes to provide a second topside connection. Dual-side testing across the electronic assembly is performed using the first and second topside connections.

Abstract: This document discusses, among other things, a system capable of resolving interactions between programmable parameters for operation of a medical device. Programming these devices is a difficult task when many parameters are involved. The disclosed systems and methods attempt to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input or calculated automatically, and constraint violations describing invalid parameter values. If possible, a set of parameter values with less egregious constraint violations is generated and may be displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: This document discusses, among other things, a system capable of resolving interactions between programmable parameters for operation of a medical device. Programming these devices is a difficult task when many parameters are involved. The disclosed systems and methods attempt to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input or calculated automatically, and constraint violations describing invalid parameter values. If possible, a set of parameter values with less egregious constraint violations is generated and may be displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: Separate IP data streams, including both voice (VoIP) and data sources, are routed over a single network data stream, encrypted by a single KIV encryption unit, and transmitted as a single packet data stream including both computer and voice data. Integration of the use of a VoIP data stream, together with data sources, and encrypted through a single serial encryption unit such as a KIV-7 enables the encryption of both voice and data using a single KIV encryption unit. After encryption by the Type 1 encryption unit (e.g., KIV-7) in a remotely deployed, secure communication system, the single encrypted data stream is encapsulated into IP packets. The IP packets are addressed to a distant IP device that removes the encapsulated, encrypted data and passes it to a similar Type 1 KIV device for decryption, and distributed to voice devices and computer devices via another voice-enabled router.

Abstract: Heat generated by operating electronic components within an environmentally-sealed enclosure is removed, without direct transmission of a viscous medium through the enclosure. An internal heat sink and external heat sink each span a given wall. The internal heat sink section is baffled and channeled with one place for air to enter, and one to exit. A fan forces air over heat sink extremities of the internal heat sink section. A circulating air column entrapped within the enclosure is drawn into the entrance of the internal heat sink, and forced through the entire length of the internal heat sink, providing for a thermal conduit for a heated entrapped air column to transfer its heat into the internal heat sink. The external heat sink is exposed to the ambient environment, with airflow managed over the external heat sink preferably with a structural surround that provides for channeling of airflow.

Abstract: A method of topside only dual-side testing of an electronic assembly includes providing a singulated through substrate via (TSV) die flip chip attached to a die support including a package substrate. The TSVs on the TSV die extend from its frontside to contactable TSV tips on its bottomside. The TSVs on the frontside of the TSV die are coupled to embedded topside substrate pads on a top surface of the ML substrate. The die support includes lateral coupling paths between at least a portion of the embedded topside substrate pads and lateral topside pads on a topside surface of the die support lateral to the die area. The contactable TSV tips are contacted with probes to provide a first topside connection to the TSVs, and the lateral topside pads are contacted with probes to provide a second topside connection. Dual-side testing across the electronic assembly is performed using the first and second topside connections.

Abstract: This document discusses, among other things, a system capable of resolving interactions between programmable parameters for operation of a medical device. Programming these devices is a difficult task when many parameters are involved. The disclosed systems and methods attempt to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input or calculated automatically, and constraint violations describing invalid parameter values. If possible, a set of parameter values with less egregious constraint violations is generated and may be displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: This document discusses, among other things, a user interface capable of resolving interactions between programmable parameters for operation of a personal medical device. Programming these devices is a difficult task when many parameters are involved. The medical device interface attempts to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input, and constraint violations describing invalid parameter values. A user is given the option to select one or more parameters to remain constant. If possible, a set of parameter values with less egregious constraint violations is displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: A synchronization system includes a first account assigned a first unique identifier. Access to the first account is contingent on validation of a shared access credential. The synchronization system also includes a second account assigned a second unique identifier. Access to the second account is contingent on validation of the shared access credential. The synchronization system further includes a library of account operations. One or more account operations are configured to utilize the first unique identifier when addressing the first account, and one or more account operations are configured to utilize the second unique identifier when addressing the second account.

Abstract: This document discusses, among other things, a user interface capable of resolving interactions between programmable parameters for operation of a personal medical device. Programming these devices is a difficult task when many parameters are involved. The medical device interface attempts to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input, and constraint violations describing invalid parameter values. A user is given the option to select one or more parameters to remain constant. If possible, a set of parameter values with less egregious constraint violations is displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: This document discusses, among other things, a user interface capable of resolving interactions between programmable parameters for operation of a personal medical device. Programming these devices is a difficult task when many parameters are involved. The medical device interface attempts to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input, and constraint violations describing invalid parameter values. A user is given the option to select one or more parameters to remain constant. If possible, a set of parameter values with less egregious constraint violations is displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: This document discusses, among other things, a user interface capable of resolving interactions between programmable parameters for operation of a personal medical device. Programming these devices is a difficult task when many parameters are involved. The medical device interface attempts to reduce and minimize constraint violations between interdependent parameters using an initial set of parameter values supplied by user (typically a physician) input, and constraint violations describing invalid parameter values. A user is given the option to select one or more parameters to remain constant. If possible, a set of parameter values with less egregious constraint violations is displayed to the user. A user is prompted to accept the set of parameter values and program the medical device.

Abstract: A dual damascene process flow for forming interconnect lines and vias in which at least part of the via (116) is etched prior to the trench etch. A low-k material such as a thermoset organic polymer is used for the ILD (106) and IMD (110). After the at least partial via etch, a BARC (120) is deposited over the structure including in the via (116). Then, the trench (126) is patterned and etched. Although at least some of the BARC (120) material is removed during the trench etch, the bottom of the via (116) is protected.

Abstract: A method of preventing seam defects on narrow, isolated lines of 0.3 micron or less during CMP process is provided. The solution is to change the size of features of dummy metal structures on the same layer as the metal layer to have a width that is about 0.6 micron or less so that during the electroplating the deposition rate in the features is similar to the narrow, isolated lines. The density, shape, and proximity of the dummy metal structures further prevents the seam defects during CMP processing by preventing Galvanic corrosion.

Abstract: A method of preventing seam defects on narrow, isolated lines of 0.3 micron or less during CMP process is provided. The solution is to change the size of features of dummy metal structures on the same layer as the metal layer to have a width that is about 0.6 micron or less so that during the electroplating the deposition rate in the features is similar to the narrow, isolated lines. The density, shape, and proximity of the dummy metal structures further prevents the seam defects during CMP processing by preventing Galvanic corrosion.