Abstract: Methods for use in the production of a display include providing a substrate assembly of a face plate of the display including a conductive surface at a first side thereof. One or more projections extend from the first side of substrate assembly. A patternable material, e.g., electrophoretically depositable resist, is electrophoretically deposited on at least the conductive surface and adjacent the projections. The method may further include patterning the patternable material for use in deposition of light emitting elements on the conductive surface. Light emitting elements of one or more colors may be formed. In addition, the substrate assembly including the conductive surface may have one or more nonconductive regions formed on the conductive surface; the one or more nonconductive regions having a predetermined thickness. A layer of patternable material is formed by electrophoresis over the conductive surface and over the one or more nonconductive regions.

Abstract: A structure used in the production of a face plate of a display includes a substrate assembly having a conductive surface at a first side thereof, one or more projections (e.g., spacers) extending from the first side of the substrate assembly, and electrophoretically deposited and patternable material (e.g., photoresist), on the conductive surface and adjacent the projections. The patternable material may define openings to the conductive surface for use in deposition of one or more light emitting elements on the conductive surface. In another embodiment, the structure used in the production of a display may comprise a substrate assembly including a conductive surface, one or more nonconductive regions (e.g., one or more phosphor light emitting elements, black matrix material, nonconductive regions have a thickness less than about 15 microns) formed on the conductive surface, and electrophoretically deposited patternable material formed over the conductive surface and the one or more nonconductive regions.

Abstract: Methods of forming face plate assemblies are described. In one implementation, a substrate is patterned with photoresist and a first phosphor-comprising material is formed over first surface areas of the substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. In a preferred aspect, processing the photoresist comprises using a heated aqueous developing solution comprising an acid, e.g. lactic acid, effective to dislodge and remove first phosphor-comprising material from beneath the developed photoresist.

Abstract: A face plate assembles substrate is patterned with photoresist and a first phosphor-comprising material is formed over the substrates first surface areas substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. A second phosphor-comprising material is formed over the substrate and exposed second areas, with trace deposits being left over other substrate areas. The photoresist is subsequently stripped leaving some of the second phosphor-comprising material over substrate areas other than the first and second areas. Photoresist is again formed over the substrate and processed to expose third substrate areas which are different from the first and second areas. A third phosphor-comprising material is formed over the substrate and the exposed third areas.

Abstract: Methods for use in the production of a display include providing a substrate assembly of a face plate of the display including a conductive surface at a first side thereof. One or more projections extend from the first side of substrate assembly. A patternable material, e.g., electrophoretically depositable resist, is electrophoretically deposited on at least the conductive surface and adjacent the projections, e.g., spacers such as nonconductive spacers or spacers that have at least portions thereof that are slightly conductive. The method may further include patterning the patternable material for use in deposition of light emitting elements on the conductive surface. Light emitting elements of one or more colors may be formed. In addition, the substrate assembly including the conductive surface may have one or more nonconductive regions formed on the conductive surface; the one or more nonconductive regions having a predetermined thickness.

Abstract: Methods of forming face plate assemblies are described. In one implementation, a substrate is patterned with photoresist and a first phosphor-comprising material is formed over first surface areas of the substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. In a preferred aspect, processing the photoresist comprises using a heated aqueous developing solution comprising an acid, e.g. lactic acid, effective to dislodge and remove first phosphor-comprising material from beneath the developed photoresist. A second phosphor-comprising material is formed over the substrate and the exposed second areas, with trace deposits being left over other substrate areas.

Abstract: Methods for use in the producing of a display include providing a substrate assembly of a face plate of the display including a conductive surface at a first side thereof. One or more projections extend from the first side of substrate assembly. A patternable material is electrophoretically deposited on at least the conductive surface and adjacent the projections. The method may further include patterning the patternable material for use in deposition of light emitting elements on the conductive surface. Light emitting elements of one or more colors may be formed. In addition, the substrate assembly including the conductive surface may have one or more nonconductive regions formed on the conductive surface; the one or more nonconductive regions having a predetermined thickness. A layer of patternable material is formed by electrophoresis over the conductive surface and over the one or more nonconductive regions.

Abstract: Methods of forming face plate assemblies are described. In one implementation, a substrate is patterned with photoresist and a first phosphor-comprising material is formed over first surface areas of the substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. In a preferred aspect, processing the photoresist comprises using a heated aqueous developing solution comprising an acid, e.g. lactic acid, effective to dislodge and remove first phosphor-comprising material from beneath the developed photoresist. A second phosphor-comprising material is formed over the substrate and the exposed second areas, with trace deposits being left over other substrate areas.

Abstract: Methods of forming face plate assemblies are described. In one implementation, a substrate is patterned with photoresist and a first phosphor-comprising material is formed over first surface areas of the substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. In a preferred aspect, processing the photoresist comprises using a heated aqueous developing solution comprising an acid, e.g. lactic acid, effective to dislodge and remove first phosphor-comprising material from beneath the developed photoresist. A second phosphor-comprising material is formed over the substrate and the exposed second areas, with trace deposits being left over other substrate areas.

Abstract: Methods of forming face plate assemblies are described. In one implementation, a substrate is patterned with photoresist and a first phosphor-comprising material is formed over first surface areas of the substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. In a preferred aspect, processing the photoresist comprises using a heated aqueous developing solution comprising an acid, e.g. lactic acid, effective to dislodge and remove first phosphor-comprising material from beneath the developed photoresist. A second phosphor-comprising material is formed over the substrate and the exposed second areas, with trace deposits being left over other substrate areas.

Abstract: Methods of forming face plate assemblies are described. In one implementation, a substrate is patterned with photoresist and a first phosphor-comprising material is formed over first surface areas of the substrate. The photoresist is stripped leaving some of the first phosphor-comprising material over substrate areas other than the first areas. Photoresist is again formed over the substrate and processed to expose second substrate areas which are different from the first substrate areas. In a preferred aspect, processing the photoresist comprises using a heated aqueous developing solution comprising an acid, e.g. lactic acid, effective to dislodge and remove first phosphor-comprising material from beneath the developed photoresist. A second phosphor-comprising material is formed over the substrate and the exposed second areas, with trace deposits being left over other substrate areas.

Abstract: Methods for use in the production of a display include providing a substrate assembly of a face plate of the display including a conductive surface at a first side thereof. One or more projections extend from the first side of substrate assembly. A patternable material, e.g., electrophoretically depositable resist, is electrophoretically deposited on at least the conductive surface and adjacent the projections, e.g., spacers such as nonconductive spacers or spacers that have at least portions thereof that are slightly conductive. The method may further include patterning the patternable material for use in deposition of light emitting elements on the conductive surface. Light emitting elements of one or more colors may be formed. In addition, the substrate assembly including the conductive surface may have one or more nonconductive regions formed on the conductive surface; the one or more nonconductive regions having a predetermined thickness.