Abstract: Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.

Abstract: Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.

Abstract: A tile (10) having a plurality of grooves (22). An array of tiles (10) is assembled by placing at least two tiles (10) in generally opposing relationship to one another, with the grooves (22) substantially juxtaposed to define wells (38). When intended for incorporation into a device (40), such as a display device, a conductive interconnect (36) is formed in the wells (38). Devices include a base substrate (40), a first plate (46) and a second plate (48). A first member (50) may be employed to separate the base substrate (40) from the first plate (46). A second member (52) may be employed to separate the first plate (46) from the second plate (48).

Abstract: A machine for cutting brittle materials includes a mandrel or shaft (200) having a first portion (310) with a taper, a sleeve (400) having an inner surface (410) and an outer surface (420) where the inner surface has the taper and is located adjacent to the first portion of the shaft, and a coating (890) around the outer surface where the coating has grooves (1010) extending around the sleeve.

Abstract: A field emission device (100, 200) includes a cathode plate (102) having a plurality of electron emitters (532), an anode plate (104) disposed to receive electrons emitted by plurality of electron emitters (532), a frame (109) interposed between cathode plate (102) and anode plate (104) and defining a central opening (112), a mating member (110, 210, 310, 410, 510) coextensive with frame (109) and disposed within central opening (112), and a getter structure (114, 214, 314, 414, 514, 614) mated with mating member (110, 210, 310, 410, 510).

Abstract: A method is provided for fabricating a display spacer assembly (100, 400, 500) useful in the fabrication of large-area field emission displays (200, 600). The method includes the steps of: forming slots (12, 22, 32, 33) in a substrate (10, 23, 30) thereby providing a jig; providing spacers (14, 24, 34) having lower rounded edges and upper edges; placing the lower rounded edges into the slots (12, 22, 32, 33) so that the spacers (14, 24, 34) are positioned in a predetermined layout pattern over the slotted jig surface; and placing the upper edges of the spacers (14, 24, 34) in abutting engagement with a display plate (18, 10) of a field emission display.

Abstract: A display spacer structure includes a frame with side members joined together to define a central opening. The side members have recessed portions positioned outside of, and in communication with, the central opening with getter material therein. Spaced apart grooves are formed in each of an opposed pair of the side members, and the ends of a plurality of spacers are fixed in the grooves. The spacers extend across the central opening to define a plurality of separate compartments which are in communication with the recessed portions so as to provide a continuous fluid phase throughout all the separate compartments.

Abstract: A method is provided for fabricating a display spacer assembly (100, 400, 500) useful in the fabrication of large-area field emission displays (200, 600). The method includes the steps of: forming slots (12, 22, 32, 33) in a substrate (10, 23, 30) thereby providing a jig; providing spacers (14, 24, 34) having lower rounded edges and upper edges; placing the lower rounded edges into the slots (12, 22, 32, 33) so that the spacers (14, 24, 34) are positioned in a predetermined layout pattern over the slotted jig surface; and placing the upper edges of the spacers (14, 24, 34) in abutting engagement with a display plate (18, 10) of a field emission display.

Abstract: A plurality of edge emitters in a FED array include a plate shaped substrate having parallel, laterally spaced apart grooves formed in a first surface and parallel, laterally spaced apart grooves formed in the opposite surface so that each second groove crosses each first groove at an angle. The combined depths of the grooves is greater than the thickness of the plate substrate so that an opening is formed through the substrate at each point where a second groove crosses a first groove. Gate metal is deposited on the surfaces in the openings and emitter material is deposited on the lands of the first surface to form FED emitters in each opening.

Abstract: A method of captivating a substrate within a holder for photolithographic processing is shown. A substrate is placed within the aperture of a holder and is sandwiched into place by laminating it with layers of dry film photopolymer resist. Portions of the photopolymer resist are polymerized. Unpolymerized portions are washed away leaving retaining tabs of polymerized resist which hold the substrate within the holder for an etching or plating process.

Abstract: A crystal is mounted on a low, centrally located pedestal. Connections to the lower side of the crystal are made by way of conductive areas on the pedestal. Multiple wiring connections are made at the edges of the crystal by allowing the bonding tool to depress the edge of the crystal so that the crystal bonding pad is supported by the base structure only during the bonding process, then released thereafter to allow free vibration of the crystal plate. Complex circuitry, possibly involving more than one frequency can thus be put onto one plate.

Abstract: A crystal is mounted on a low, centrally located pedestal. Connections to the lower side of the crystal are made by way of conductive areas on the pedestal. Multiple wiring connections are made at the edges of the crystal by allowing the bonding tool to depress the edge of the crystal so that the crystal bonding pad is supported by the base structure only during the bonding process, then released thereafter to allow free vibration of the crystal plate. Complex circuitry, possibly involving more than one frequency can thus be put onto one plate.

Abstract: A monolithic crystal filter formed by a multi-section piezoelectric resonator having anodizable electrodes is subjected to plasma from a low energy oxygen glow device to adjust the frequency response. The electrodes are selectively connected to potentials whereby the electrodes are individually anodized to increase the density thereof and change the frequency response of the resonator. The glow device includes anode and cathode rings separated by an insulator ring which holds a cathode screen across the cathode. The anode ring has a concave face and the inside diameter is generally the same as the diameter of the resonator so that the resonator can be placed close to the anode and plasma is localized on the resonator electrodes. The electrodes are connected in a frequency measuring circuit so that the response is monitored and the extent of anodization of the individual electrodes is controlled.