Abstract: Electrical devices having tunable capacitance are provided. The tunable capacitance is achieved by placing an appropriate material between substrate layers and by controllably applying a pressure to the material to compress the material or alter the shape of a well in which the material is contained, and thereby alter the capacitance of the electrical device. The composition, shape and dimension of the embedded materials determine how the capacitance of the electrical device is altered upon compression of the embedded material in response to an applied control signal. Generally, as the embedded material is compressed, the material will become more dense and the capacitance of the integrated electrical device is altered.

Abstract: An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

Abstract: Electrical devices having tunable capacitance are provided. The tunable capacitance is achieved by placing an appropriate material between substrate layers and by controllably applying a pressure to the material to compress the material or alter the shape of a well in which the material is contained, and thereby alter the capacitance of the electrical device. The composition, shape and dimension of the embedded materials determine how the capacitance of the electrical device is altered upon compression of the embedded material in response to an applied control signal. Generally, as the embedded material is compressed, the material will become more dense and the capacitance of the integrated electrical device is altered.

Abstract: Electrical devices having tunable electrical characteristics are provided, such as variable resistors, capacitors and inductors. The tunable electrical characteristics are achieved by placing an appropriate material between substrate layers and by controllably applying a pressure to the material to compress the material or alter the shape of a well in which the material is contained, and thereby alter the electrical characteristics of the electrical device. The composition, shape and dimension of the embedded materials determine how the electrical characteristics of the electrical device are altered upon compression of the embedded material in response to an applied control signal. Generally, as the embedded material is compressed, the material will become more dense and the electrical characteristics of the integrated electrical device is altered.

Abstract: An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.