Patents by Inventor Jeffery J. Kirk

Jeffery J. Kirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Panel molded electronic assemblies with multi-surface conductive contacts
    Patent number: 11324107
    Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 3, 2022
    Assignee: Vicor Corporation
    Inventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico
  • Methods of forming modular assemblies
    Patent number: 10537015
    Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: January 14, 2020
    Assignee: VLT, Inc.
    Inventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico
  • Method of electrically interconnecting circuit assemblies
    Patent number: 10264664
    Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: April 16, 2019
    Assignee: VLT, Inc.
    Inventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico