Patents by Inventor Jeffery L. Reynolds

Jeffery L. Reynolds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9315664
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: April 19, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
  • Patent number: 9206349
    Abstract: A process for producing a proppant particulate substrate having a coating layer thereon including the step of blending a proppant particulate substrate with a powder coating composition at a temperature sufficient to cause the powder coating composition to coat the proppant particulate substrate with a powder coating; and a proppant particulate substrate coated by such a process.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: December 8, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Rajesh Turakhia, Jeffery L. Reynolds, George Jacob
  • Publication number: 20140235792
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Application
    Filed: April 29, 2014
    Publication date: August 21, 2014
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
  • Patent number: 8742018
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: June 3, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George Jacob, Marty J. Null
  • Publication number: 20110024129
    Abstract: A process for producing a proppant particulate substrate having a coating layer thereon including the step of blending a proppant particulate substrate with a powder coating composition at a temperature sufficient to cause the powder coating composition to coat the proppant particulate substrate with a powder coating; and a proppant particulate substrate coated by such a process.
    Type: Application
    Filed: March 24, 2009
    Publication date: February 3, 2011
    Inventors: Rajesh Turakhia, Jeffery L. Reynolds, George Jacob
  • Publication number: 20100292415
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Application
    Filed: January 5, 2009
    Publication date: November 18, 2010
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George Chennakattu Jacob, Marty J. Null