Patents by Inventor Jeffery N. Gleason

Jeffery N. Gleason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Intermediate semiconductor device structure
    Patent number: 7687879
    Abstract: The present invention relates to a method of forming a metal feature on an intermediate structure of a semiconductor device that comprises a first exposed metal structure and a second exposed metal structure. The metal feature is selectively formed on the first exposed metal structure without forming on the second exposed metal structure. By adjusting a concentration of stabilizer in an electroless plating solution, the metal feature is electrolessly plated on the first exposed metal structure without plating metal on the second exposed metal structure.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: March 30, 2010
    Assignee: Micron Technology, Inc.
    Inventor: Jeffery N. Gleason
  • Nickel bonding cap over copper metalized bondpads
    Patent number: 7485565
    Abstract: A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: February 3, 2009
    Assignee: Micron Technologies, Inc.
    Inventors: Jeffery N. Gleason, Joseph T. Lindgren
  • Nickel bonding cap over copper metalized bondpads
    Patent number: 7186636
    Abstract: A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: March 6, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Jeffery N. Gleason, Joseph T. Lindgren
  • Nickel bonding cap over copper metalized bondpads
    Patent number: 7067924
    Abstract: A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: June 27, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Jeffery N. Gleason, Joseph T. Lindgren
  • Nickel bonding cap over copper metalized bondpads
    Patent number: 6825564
    Abstract: A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: November 30, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jeffery N. Gleason, Joseph T. Lindgren
  • Using stabilizers in electroless solutions to inhibit plating of fuses
    Publication number: 20040157440
    Abstract: The present invention relates to a method of forming a metal feature on an intermediate structure of a semiconductor device that comprises a first exposed metal structure and a second exposed metal structure. The metal feature is selectively formed on the first exposed metal structure without forming on the second exposed metal structure. By adjusting a concentration of stabilizer in an electroless plating solution, the metal feature is electrolessly plated on the first exposed metal structure without plating metal on the second exposed metal structure.
    Type: Application
    Filed: October 20, 2003
    Publication date: August 12, 2004
    Inventor: Jeffery N. Gleason
  • Nickel bonding cap over copper metalized bondpads
    Publication number: 20040036137
    Abstract: A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.
    Type: Application
    Filed: August 21, 2002
    Publication date: February 26, 2004
    Inventors: Jeffery N. Gleason, Joseph T. Lindgren
  • USING STABILIZERS IN ELECTROLESS SOLUTIONS TO INHIBIT PLATING OF FUSES
    Publication number: 20030219976
    Abstract: The present invention relates to a method of forming a metal feature on an intermediate structure of a semiconductor device that comprises a first exposed metal structure and a second exposed metal structure. The metal feature is selectively formed on the first exposed metal structure without forming on the second exposed metal structure. By adjusting a concentration of stabilizer in an electroless plating solution, the metal feature is electrolessly plated on the first exposed metal structure without plating metal on the second exposed metal structure.
    Type: Application
    Filed: May 24, 2002
    Publication date: November 27, 2003
    Inventor: Jeffery N. Gleason