Abstract: An apparatus for remotely rebooting an electronic device may have an first port adapted to interface with a first communications line capable of transmitting and receiving both data and power, an second port adapted to interface with a second communications line capable of transmitting and receiving both data and power, at least two status light emitting diodes, and at least one power port capable of receiving power from an external power supply module. The apparatus uses an auto-ping, traffic monitor, and heartbeat methodology to manage the operable state of a PSE, PD, or Ethernet traffic. If either one is deemed to have become non-functional or otherwise fall below set operating standards, the apparatus sends a signal to reboot the particular device in question. This removes the need for a manual reboot of a particular device such as a peripheral device in an electronic system.

Abstract: An apparatus for remotely rebooting an electronic device may have an first port adapted to interface with a first communications line capable of transmitting and receiving both data and power, an second port adapted to interface with a second communications line capable of transmitting and receiving both data and power, at least two status light emitting diodes, and at least one power port capable of receiving power from an external power supply module. The apparatus uses an auto-ping, traffic monitor, and heartbeat methodology to manage the operable state of a PSE, PD, or Ethernet traffic. If either one is deemed to have become non-functional or otherwise fall below set operating standards, the apparatus sends a signal to reboot the particular device in question. This removes the need for a manual reboot of a particular device such as a peripheral device in an electronic system.

Abstract: Techniques for improving the manufacture and structure of leadframe chip scale packages and land grid array packages are described. One aspect of the invention pertains to a method for patterning a conductive substrate, which is utilized to form a packaged semiconductor device, wherein a metallic barrier layer and a second metallic layer are utilized as an etching resist. A method, according to another aspect of the invention pertains to covering a metallic barrier layer and second metallic layer with a etch resistant cap such that the etch resistant cap is used as a etching resist. In another aspect of the present invention, a method for treating a conductive leadframe with a CZ treatment is disclosed. In yet another aspect of the present invention, techniques relating to locking grooves within the studs of a studded leadframe are disclosed.