Patents by Inventor Jeffery Scott Thornpson

Jeffery Scott Thornpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Volatile copper (II) complexes and reducing agents for deposition of copper films by Atomic Layer Deposition
    Patent number: 7268365
    Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.
    Type: Grant
    Filed: June 20, 2006
    Date of Patent: September 11, 2007
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Alexander Zak Bradley, Jeffery Scott Thornpson, David Lincoln Thorn
  • Volatile copper(II) complexes and reducing agents for deposition of copper films by atomic layer deposition
    Patent number: 7087774
    Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: August 8, 2006
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Alexander Zak Bradley, David Lincoln Thorn, Jeffery Scott Thornpson