Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Abstract: Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.

Abstract: Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.

Abstract: Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.

Abstract: Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.

Abstract: An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.

Abstract: Connectors for processing packages are disclosed herein. An example male connector includes a plurality of wires. The example male connector further includes a socket pin. The example male connector further includes a paddle board connected to the socket pin. The example male connector further includes an overmolded cable housing the plurality of wires, the overmolded cable coupled to the paddle board, one of the plurality of wires coupled to the socket pin via the paddle board. The example male connector further includes a molded region to encompass the plurality of wires within a flat portion, the overmolded cable housing and the molded region to increase a height of the wires from the paddle board from a first height to a second height.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.

Abstract: An electronic system and associated methods are disclosed. In one example, the electronic system includes an interposer including electrically conductive interposer interconnect, a first interposer surface, and a second interposer surface; a processor package including at least one processor integrated circuit (IC), the processor package attached to the first interposer surface and electrically connected to the interposer interconnect; a first liquid metal well array including multiple liquid metal wells attached to a second interposer surface and the interposer interconnect; a second liquid metal well array including a first array surface attached to the first interposer surface and the interposer interconnect; and a packaged companion IC to the processor IC attached to a second array surface of the second liquid metal well array.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes an integrated circuit (IC) package substrate including package interconnect and a first substrate surface; a processor IC attached to the first substrate surface and electrically connected to the package interconnect; a liquid metal well array including multiple liquid metal wells, a first array surface attached to the first substrate surface, and a second array surface; and a companion component to the processor IC attached to the second array surface of the liquid metal well array.

Abstract: An electronic system and associated methods are disclosed. In one example, the electronic system includes a processor package including at least one processor integrated circuit (IC); an interposer including electrically conductive interposer interconnect; a first liquid metal well array including multiple liquid metal wells arranged between the processor package and the interposer, wherein the first liquid metal well array is attached to a surface of the processor package and attached to a first surface of the interposer and the interposer interconnect; a printed circuit board (PCB) attached to a second surface of the interposer and the interposer interconnect; a second liquid metal well array including a first surface attached to the first surface of the interposer and the interposer interconnect; and a first companion component package attached to a second surface of the second liquid metal well array.

Abstract: A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes liquid metal pathways that form one or more conduction pathway through one or more dielectric layers. In selected examples, the dielectric layers are resilient, which allows for flexibility of interconnect components.