Abstract: A latching mechanism comprising a hook connected to a first component. The hook has a first position disposed within the first component and a second position extending from the first component. The latching mechanism further comprising a receptacle disposed within a second component and engaged with the hook. A magnet is disposed within the second component and moves the hook from the first position to the second position as the second component is disposed in close proximity to the first component. A push-button release mechanism is disposed within the first component and moves the hook from the second position so as to disengage said hook from said receptacle.

Abstract: A system and related method of a computer card slot and a bezel. Some of the exemplary embodiments may be a portable computer comprising a computer card slot accessible through an aperture in a housing of the portable computer, a card reader electrically coupled within the computer card slot, and a bezel mechanically abutting an outer end of the card reader (at least a portion of an outer face of the bezel substantially coplanar with the housing). The computer card slot comprises a computer card ejection actuation mechanism proximate to the aperture in the first side, and wherein the bezel at least partially covers the ejection actuation mechanism.

Abstract: A customizable portable computer system comprising a portable computer chassis. A door is detachably attached to the chassis so as to substantially cover an aperture through a wall of the chassis. The door is operable to support an electronic module. The portable computer system also comprises a cable having a first end that is coupled to the computer system and a second end that is accessible through the aperture and operable to couple to the electronic module.

Abstract: A system comprises an electronic device having a component to be cooled. The electronic device has at least one heat pipe coupled to the component. A heat exchanger system is coupled to the at least one heat pipe. Also, the electronic device comprises a fan having a plurality of exhaust outlets oriented to exhaust air toward the heat exchanger system.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: A hard disk drive is removably insertable into a portable computer base housing through a first opening therein to position the disk drive in a side-by-side relationship with a battery pack removable from within the housing through a second opening therein. In response to the insertion of the disk drive, a security latch mechanism within the housing releasably locks the disk drive therein. The latch mechanism has a movable release portion which is disposed within the housing, with manual access to the release portion being blocked by the battery pack which must be removed to permit the release portion to be operated to allow the disk drive to be removed from the housing. A latch member is positioned on a bottom exterior side portion of the housing and is operable to permit removal of the battery pack from the housing to provide access to the interior disk drive latch mechanism release portion.