Abstract: A memory card comprising a flexible substrate (a “flex”) which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.

Abstract: A top port MEMS package includes a substrate and an interposer mounted to the substrate. The interposer includes an interposer aperture and an interposer channel fluidly coupled to the interposer aperture. A MEMS electronic component is mounted to the interposer above the interposer aperture. A top port lid includes a top port and a chimney structure fluidly coupling to the top port to the interposer channel. A front volume including the top port, the flue, the interposer channel, and the interposer aperture is acoustically sealed from a relatively large back volume defined by a lid cavity of the top port lid. By acoustically sealing the front volume from the back volume and further by maximizing the back volume, the noise to signal ratio is minimized thus maximizing the sensitivity of top port MEMS microphone package as well as the range of applications.

Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

Abstract: A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape the bottom contact surfaces of the contacts, at least portions of the bottom dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the bottom contact surfaces are exposed in an exterior surface thereof.

Abstract: A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the first surface of the die pad is at least one electronic component which is electrically connected to at least one of the contacts either directly or via one or more of the traces. A first encapsulation part covers the second surfaces of the die pad and the traces, with the second surfaces of the contacts being exposed in the first encapsulation part. A second encapsulation part covers the electronic component and the first surfaces of the die pad, the contacts, and the traces. The first and second encapsulation parts collectively define a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

Abstract: A memory card comprising a leadframe having a plurality of contacts. Electrically connected to the leadframe is at least one semiconductor die. A body at least partially encapsulates the leadframe and includes opposed top and bottom surfaces, an opposed pair of longitudinal sides, and an opposed pair of lateral sides. The contacts of the leadframe are exposed in the bottom surface of the body and extend to one of the lateral sides thereof.

Abstract: A memory card comprising a substrate which has a plurality of contacts and a plurality of metal features. The contacts and the metal features are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the substrate is at least one electronic component which is electrically connected thereto. A body covers the electronic component and at least portions of the contacts and the metal features such that the second surfaces of the contacts and the metal features are exposed in a common exterior surface of the body.

Abstract: A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and partially covers the insert such that the contacts are exposed in an exterior surface of the body.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the first surface of the die pad is at least one electronic component which is electrically connected to at least one of the contacts either directly or via one or more of the traces. A first encapsulation part covers the second surfaces of the die pad and the traces, with the second surfaces of the contacts being exposed in the first encapsulation part. A second encapsulation part covers the electronic component and the first surfaces of the die pad, the contacts, and the traces. The first and second encapsulation parts collectively define a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

Abstract: A semiconductor package comprising a substrate which includes a leadframe having a plurality of leads which each define opposed top and bottom surfaces and extends in spaced relation to each other such that gaps are defined therebetween. The substrate further comprises a compound layer which is filled within the gaps defined between the leads. The substrate includes a continuous, generally planar top surface collectively defined by the top surfaces of the leads and compound layer, and a continuous, generally planar bottom surface collectively defined by the bottom surfaces of the leads and compound layer. Attached to the top surface is a semiconductor die which is electrically connected to at least some of the leads.

Abstract: A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.

Abstract: A media card comprising a leadframe having first and second die pads, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts towards the first and second die pads. The second die pad is bent in a manner facilitating the formation of a cavity therein. Attached to the first die pad is a semiconductor die which is electrically connected to the leadframe. Disposed within the cavity and electrically connected to the leadframe is an electronic component. A body at least partially encapsulates the leadframe, the semiconductor die and the electronic component such that the contacts are exposed in the bottom surface defined by the body. The electronic component is shielded from radio frequency as a result of its receipt into the cavity defined by the second die pad of the lead frame.

Abstract: A lead-frame connector and circuit module assembly allows fabrication of a pin-connector type circuit module without a circuit board substrate and discrete connector. One or more integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. Connector pins formed on an extension of the lead-frame assembly provide an electrical interface to a mating connector without requiring a separate connector mounted on a substrate. An extension of the lead-frame assembly out of the circuit interconnect plane provides a multi-row pin connector in applications where a multi-row connector is needed.

Abstract: A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.

Abstract: A memory card comprising a leadframe having a plurality of contacts. Electrically connected to the leadframe is at least one semiconductor die. A body at least partially encapsulates the leadframe and includes opposed top and bottom surfaces, an opposed pair of longitudinal sides, and an opposed pair of lateral sides. Each of the contacts of the leadframe is exposed in the bottom surface of the body and includes a chamfer portion which extends to one of the lateral sides thereof.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: A memory card comprising a leadframe which includes a main frame defining a peripheral side. Extending toward the peripheral side of the main frame is a first set of leads, while extending away from the peripheral side is a second set of leads which are disposed in juxtaposed relation to respective ones of the leads of the first set. Positioned upon the main frame and electrically connected to the leads of the first and second sets is an electrical subassembly. A package body at least partially encapsulates the leadframe and the electrical subassembly. Portions of the leads of the first and second sets are exposed within the package body and mimic the structural and functional attributes of the fifty pin connector of a conventional CF card.

Abstract: A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.