Abstract: A tray for holding IC packages including cylindrical cases having preformed leads flared radially outward from the bottom thereof with flat portions of the free ends of leads being in a common plane. The tray comprises a top plate having a plurality of funnel shaped openings in it, a rim around the perimeter of the plate, and a flat bottom. Each opening has a cylindrical bottom portion for receiving a case with leads thereon being located in the flared upper portion of the opening and below the surface of the plate. The top and bottom edges of trays are dimensioned so that the top of a first tray nests inside the bottom of a second tray. By merely turning these nested trays over, packages in openings in the first tray sit with the flat portions of leads on the bottom of the second tray. The rim limits transverse movement of packages set on the plate when the tray is shaken to cause them to fall into associated openings.