Abstract: A method and apparatus is provided for preparing samples for observation in a charged particle beam system in a manner that reduces or prevents artifacts. Material is deposited onto the sample using charged particle beam deposition just before or during the final milling, which results in an artifact-free surface. Embodiments are useful for preparing cross sections for SEM observation of samples having layers of materials of different hardnesses. Embodiments are useful for preparation of thin TEM samples.

Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.

Abstract: A method and system for collecting and analyzing photoemission data wherein illumination and photoemission images are acquired for a plurality of die, such as for each die on a wafer. Then, the images are overlaid, aligned, and assembled in a mosaic, thereby allowing analysis of the photoemission occurring across a plurality of die, such as across the entire wafer. Preferably, gathering this data allows statistical analysis of the photoemission such as analysis of commonly emitting locations to identify structures/cells that are sensitive to the manufacturing process.

Abstract: A method and apparatus for probing semiconductor circuits using a wafer-mounted micro-probing platform. A platform or platen is affixed to the surface of a wafer. Probe manipulators are mounted on the platen, and probes extend from or are otherwise associated with the probe manipulators. The probe manipulators may be fixed in position, or they may be motorized to allow adjustment of the probe positions while in-situ. During probing, electrical signals are preferably sent to the probes viz.-a-viz. feedthrough interfaces. The platen which is affixed to the surface of the wafer effectively serves two purposes: 1) as a mounting point for the probe manipulators; and 2) to mechanically stiffen the wafer so that the wafer does not flex, thereby requiring re-positioning of the probes.

Abstract: A method and system for collecting and analyzing photoemission data wherein illumination and photoemission images are acquired for a plurality of die, such as for each die on a wafer. Then, the images are overlaid, aligned, and assembled in a mosaic, thereby allowing analysis of the photoemission occurring across a plurality of die, such as across the entire wafer. Preferably, gathering this data allows statistical analysis of the photoemission such as analysis of commonly emitting locations to identify structures/cells that are sensitive to the manufacturing process.

Abstract: A method and apparatus for probing semiconductor circuits using a wafer-mounted micro-probing platform. A platform or platen is affixed to the surface of a wafer. Probe manipulators are mounted on the platen, and probes extend from or are otherwise associated with the probe manipulators. The probe manipulators may be fixed in position, or they may be motorized to allow adjustment of the probe positions while in-situ. During probing, electrical signals are preferably sent to the probes viz.-a-viz. feedthrough interfaces. The platen which is affixed to the surface of the wafer effectively serves two purposes: 1) as a mounting point for the probe manipulators; and 2) to mechanically stiffen the wafer so that the wafer does not flex, thereby requiring re-positioning of the probes.