Patents by Inventor Jeffrey Blahnik
Jeffrey Blahnik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420275Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.Type: ApplicationFiled: September 8, 2023Publication date: December 28, 2023Applicant: Applied Materials, Inc.Inventors: Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
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Patent number: 11791176Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.Type: GrantFiled: October 28, 2019Date of Patent: October 17, 2023Assignee: Applied Materials, Inc.Inventors: Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
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Patent number: 10831112Abstract: Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.Type: GrantFiled: February 21, 2019Date of Patent: November 10, 2020Assignee: Applied Materials, Inc.Inventors: James Strassner, Charles Carlson, Robert Brent Vopat, Jeffrey Blahnik
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Publication number: 20200135508Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.Type: ApplicationFiled: October 28, 2019Publication date: April 30, 2020Inventors: Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
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Publication number: 20190189499Abstract: Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.Type: ApplicationFiled: February 21, 2019Publication date: June 20, 2019Inventors: James Strassner, Charles Carlson, Robert Brent Vopat, Jeffrey Blahnik
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Patent number: 10256132Abstract: Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.Type: GrantFiled: April 28, 2016Date of Patent: April 9, 2019Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: James Strassner, Charles Carlson, Robert Brent Vopat, Jeffrey Blahnik
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Patent number: 10186449Abstract: Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.Type: GrantFiled: December 21, 2017Date of Patent: January 22, 2019Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Joseph Yudovsky, Jeffrey Blahnik
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Publication number: 20180190535Abstract: Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.Type: ApplicationFiled: December 21, 2017Publication date: July 5, 2018Inventors: William T. Weaver, Joseph Yudovsky, Jeffrey Blahnik
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Publication number: 20170315437Abstract: Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.Type: ApplicationFiled: April 28, 2016Publication date: November 2, 2017Inventors: James Strassner, Charles Carlson, Brent Vopat, Jeffrey Blahnik
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Patent number: 9696097Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.Type: GrantFiled: October 1, 2014Date of Patent: July 4, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Kallol Bera, Kim Vellore, Andrew Constant, Jacob Newman, Jeffrey Blahnik, Jason Schaller, William Weaver, Robert Vopat, Benjamin Riordon
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Publication number: 20160033205Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.Type: ApplicationFiled: October 1, 2014Publication date: February 4, 2016Inventors: KALLOL BERA, KIM VELLORE, ANDREW CONSTANT, JACOB NEWMAN, JEFFREY BLAHNIK, JASON SCHALLER, WILLIAM WEAVER, ROBERT VOPAT, BENJAMIN RIORDON
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Publication number: 20140241848Abstract: A slitvalve that uses magnetic energy to move a door in a direction normal to the plane of the wall is disclosed. An electrically switchable magnet is used to draw the door toward the wall to seal an aperture in the wall. Compressed Dry Air or other mechanisms may be employed to move the door between a first open position and a second closed position. A method of passing a workpiece between two different environments utilizing this magnetic slitvalve is also disclosed.Type: ApplicationFiled: February 25, 2013Publication date: August 28, 2014Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: Robert Brent Vopat, Jeffrey Blahnik, Christopher Grant, William T. Weaver
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Publication number: 20120017938Abstract: To achieve cost efficiency, solar cells must be processed at a high throughput. Breakages, which may leave debris on the clamping surface of the platen, adversely affect this throughput. A plurality of embodiments are disclosed which may be used to remove debris from the clamping surface without breaking the vacuum condition within the processing station. In some embodiments, a brush is used to sweep the debris from the surface of the platen. In other embodiments, an adhesive material is used to collect the debris. In some embodiments, the automation equipment used to handle masks may also be used to handle the platen cleaning mechanisms. In still other embodiments, stream of gas or ion beams are used to clean debris from the clamping surface of the platen.Type: ApplicationFiled: July 20, 2011Publication date: January 26, 2012Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: William T. Weaver, Kevin M. Daniels, Dale K. Stone, Russell J. Low, Benjamin B. Riordon, Jeffrey Blahnik