Patents by Inventor Jeffrey C. Blahnik
Jeffrey C. Blahnik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335414Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 21, 2023Publication date: October 19, 2023Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 11610787Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 1, 2020Date of Patent: March 21, 2023Assignee: Brooks Automation US, LLCInventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20210175096Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 1, 2020Publication date: June 10, 2021Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C, BLAHNIK, Ho Yin Owen FONG
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Patent number: 10854478Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 20, 2019Date of Patent: December 1, 2020Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20200126820Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 20, 2019Publication date: April 23, 2020Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 10586720Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: GrantFiled: March 5, 2019Date of Patent: March 10, 2020Assignee: APPLIED MATERIALS, INC.Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, Jr., Robert Mitchell
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Patent number: 10541157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: October 24, 2016Date of Patent: January 21, 2020Assignee: BROOKS AUTOMATION, INC.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20190198368Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: ApplicationFiled: March 5, 2019Publication date: June 27, 2019Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, JR., Robert Mitchell
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Patent number: 10256125Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: GrantFiled: June 3, 2016Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, Jr., Robert Mitchell
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Publication number: 20180226280Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: August 9, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Publication number: 20180114708Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: April 26, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 9478446Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: March 3, 2014Date of Patent: October 25, 2016Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20160284578Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: ApplicationFiled: June 3, 2016Publication date: September 29, 2016Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, JR., Robert Mitchell
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Patent number: 9378994Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: GrantFiled: March 14, 2014Date of Patent: June 28, 2016Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, Jr., Robert Mitchell
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Patent number: 9016998Abstract: A load lock having a reduced volume, thereby allowing faster pumping and venting, is disclosed. The load lock uses a movable bottom wall to modify the volume of the chamber to be pumped. In a first position, the movable wall is disposed so as to create a small internal volume. In a second position, the bottom wall is moved downward, allowing the workpiece to be in contact with a process chamber or an exit aperture. The bottom wall may be sealed in the first position through the use of a sealing mechanism, such as a magnetic clamp. The bottom wall may also include a workpiece holding mechanism. The top wall may be a removable cover, which is moved by an actuator. A robotic mechanism may supply workpieces to the load lock while the top wall is in the open position.Type: GrantFiled: March 14, 2013Date of Patent: April 28, 2015Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Jeffrey C. Blahnik, Robert Brent Vopat, William T. Weaver
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Publication number: 20140271057Abstract: Embodiments of substrate handling systems capable of heating and/or cooling batches of substrates being transferred into and out of various substrate processing chambers are provided. Methods of substrate handling are also provided, as are numerous other aspects.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Inventors: William T. Weaver, Jason M. Schaller, Malcolm N. Daniel, JR., Robert B. Vopat, Jeffrey C. Blahnik, Joseph Yudovsky
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Publication number: 20140271054Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, JR., Robert Mitchell
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Publication number: 20140178157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 3, 2014Publication date: June 26, 2014Applicant: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8662812Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: September 24, 2012Date of Patent: March 4, 2014Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8272825Abstract: A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.Type: GrantFiled: May 19, 2008Date of Patent: September 25, 2012Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong