Patents by Inventor Jeffrey C. Maling
Jeffrey C. Maling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11167980Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.Type: GrantFiled: August 27, 2015Date of Patent: November 9, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
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Patent number: 11021364Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.Type: GrantFiled: July 10, 2018Date of Patent: June 1, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper
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Patent number: 10978416Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.Type: GrantFiled: September 17, 2019Date of Patent: April 13, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey P. Gambino, Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling
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Patent number: 10906803Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.Type: GrantFiled: June 21, 2019Date of Patent: February 2, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper
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Patent number: 10882736Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: GrantFiled: January 28, 2019Date of Patent: January 5, 2021Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, WISPRY, INCInventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 10833038Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.Type: GrantFiled: January 17, 2017Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey P. Gambino, Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling
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Patent number: 10784833Abstract: A method for forming a lamb acoustic wave resonator and filter and the resulting device are provided. Embodiments include forming a sacrificial layer over a substrate; forming a first electrode over the sacrificial layer; forming a piezoelectric thin film over the first electrode; forming a second electrode over the piezoelectric thin film; forming a hardmask over the second electrode; etching through the hardmask and the second electrode down to the piezoelectric thin film forming self-aligned vias; forming and patterning a photoresist layer over the self-aligned vias; etching through the photoresist layer forming cavities extending through the vias and to the sacrificial layer; and removing the sacrificial layer forming a cavity gap under the cavities and first metal electrode.Type: GrantFiled: April 4, 2017Date of Patent: September 22, 2020Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.Inventors: Humberto Campanella Pineda, Anthony Kendall Stamper, Jeffrey C. Maling, Sharath Poikayil Satheesh, You Qian, Rakesh Kumar
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Patent number: 10589992Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.Type: GrantFiled: March 16, 2018Date of Patent: March 17, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
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Patent number: 10589991Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.Type: GrantFiled: February 12, 2018Date of Patent: March 17, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
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Patent number: 10549987Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.Type: GrantFiled: March 9, 2018Date of Patent: February 4, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
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Publication number: 20200014171Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.Type: ApplicationFiled: September 17, 2019Publication date: January 9, 2020Inventors: Jeffrey P. GAMBINO, Richard S. GRAF, Robert K. LEIDY, Jeffrey C. MALING
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Patent number: 10476227Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.Type: GrantFiled: January 17, 2017Date of Patent: November 12, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey P. Gambino, Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling
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Publication number: 20190315619Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.Type: ApplicationFiled: June 21, 2019Publication date: October 17, 2019Inventors: Russell T. HERRIN, Jeffrey C. MALING, Anthony K. STAMPER
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Patent number: 10414646Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.Type: GrantFiled: October 18, 2017Date of Patent: September 17, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper
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Publication number: 20190152768Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: ApplicationFiled: January 28, 2019Publication date: May 23, 2019Applicant: WiSpry, Inc.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 10227230Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: GrantFiled: July 10, 2018Date of Patent: March 12, 2019Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, WISPRY, INC.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 10189705Abstract: An integrated monolithic device with a micro-electromechanical system (MEMS) and an integrated circuit (IC) and a method of forming thereof is disclosed. The monolithic device includes a substrate with IC components and a MEMS formed over the IC. A back-end-of-line (BEOL) dielectric having IC interconnect pads in a pad level is formed over the substrate. A MEMS is formed over the BEOL dielectric with the IC interconnect pads. The MEMS includes a MEMS stack having an active MEMS layer and patterned top and bottom MEMS electrodes formed on the top and bottom surfaces of the active MEMS layer. IC MEMS contact vias are formed at least partially through the active MEMS layer. IC MEMS contacts are formed in the IC MEMS contact vias in the active MEMS layer and configured to couple to the IC interconnect pads.Type: GrantFiled: October 25, 2017Date of Patent: January 29, 2019Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Humberto Campanella Pineda, Anthony Kendall Stamper, You Qian, Sharath Poikayil Satheesh, Jeffrey C. Maling, Rakesh Kumar
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Publication number: 20180319652Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.Type: ApplicationFiled: July 10, 2018Publication date: November 8, 2018Inventors: Russell T. HERRIN, Jeffrey C. MALING, Anthony K. STAMPER
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Publication number: 20180319653Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: ApplicationFiled: July 10, 2018Publication date: November 8, 2018Applicant: WiSpry, Inc.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 10093537Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.Type: GrantFiled: October 23, 2017Date of Patent: October 9, 2018Assignee: International Business Machines CorporationInventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper