Patents by Inventor Jeffrey C. Maling

Jeffrey C. Maling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190315619
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 17, 2019
    Inventors: Russell T. HERRIN, Jeffrey C. MALING, Anthony K. STAMPER
  • Patent number: 10414646
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: September 17, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper
  • Publication number: 20190152768
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
    Type: Application
    Filed: January 28, 2019
    Publication date: May 23, 2019
    Applicant: WiSpry, Inc.
    Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
  • Patent number: 10227230
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: March 12, 2019
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, WISPRY, INC.
    Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
  • Patent number: 10189705
    Abstract: An integrated monolithic device with a micro-electromechanical system (MEMS) and an integrated circuit (IC) and a method of forming thereof is disclosed. The monolithic device includes a substrate with IC components and a MEMS formed over the IC. A back-end-of-line (BEOL) dielectric having IC interconnect pads in a pad level is formed over the substrate. A MEMS is formed over the BEOL dielectric with the IC interconnect pads. The MEMS includes a MEMS stack having an active MEMS layer and patterned top and bottom MEMS electrodes formed on the top and bottom surfaces of the active MEMS layer. IC MEMS contact vias are formed at least partially through the active MEMS layer. IC MEMS contacts are formed in the IC MEMS contact vias in the active MEMS layer and configured to couple to the IC interconnect pads.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: January 29, 2019
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Humberto Campanella Pineda, Anthony Kendall Stamper, You Qian, Sharath Poikayil Satheesh, Jeffrey C. Maling, Rakesh Kumar
  • Publication number: 20180319652
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Application
    Filed: July 10, 2018
    Publication date: November 8, 2018
    Inventors: Russell T. HERRIN, Jeffrey C. MALING, Anthony K. STAMPER
  • Publication number: 20180319653
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
    Type: Application
    Filed: July 10, 2018
    Publication date: November 8, 2018
    Applicant: WiSpry, Inc.
    Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
  • Patent number: 10093537
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: October 9, 2018
    Assignee: International Business Machines Corporation
    Inventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper
  • Publication number: 20180287587
    Abstract: A method for forming a lamb acoustic wave resonator and filter and the resulting device are provided. Embodiments include forming a sacrificial layer over a substrate; forming a first electrode over the sacrificial layer; forming a piezoelectric thin film over the first electrode; forming a second electrode over the piezoelectric thin film; forming a hardmask over the second electrode; etching through the hardmask and the second electrode down to the piezoelectric thin film forming self-aligned vias; forming and patterning a photoresist layer over the self-aligned vias; etching through the photoresist layer forming cavities extending through the vias and to the sacrificial layer; and removing the sacrificial layer forming a cavity gap under the cavities and first metal electrode.
    Type: Application
    Filed: April 4, 2017
    Publication date: October 4, 2018
    Inventors: Humberto CAMPANELLA PINEDA, Anthony Kendall STAMPER, Jeffrey C. MALING, Sharath POIKAYIL SATHEESH, You QIAN, Rakesh KUMAR
  • Patent number: 10081534
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: September 25, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
  • Publication number: 20180201502
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: March 9, 2018
    Publication date: July 19, 2018
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Publication number: 20180201503
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Publication number: 20180179052
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: February 12, 2018
    Publication date: June 28, 2018
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Patent number: 9981842
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 29, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Patent number: 9969613
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: May 15, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Patent number: 9938137
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: April 10, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Patent number: 9932222
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: April 3, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Publication number: 20180057357
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Application
    Filed: October 23, 2017
    Publication date: March 1, 2018
    Inventors: Russell T. HERRIN, Jeffrey C. MALING, Anthony K. STAMPER
  • Publication number: 20180050903
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 22, 2018
    Inventors: Russell T. HERRIN, Jeffrey C. MALING, Anthony K. STAMPER
  • Patent number: 9890039
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: February 13, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper