Patents by Inventor Jeffrey Coffin

Jeffrey Coffin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150368041
    Abstract: The Dual Door Trash Container allows a trash bag to be removed much easier and faster along with easier cleaning. The two doors swing away from the center to the left and right to allow enough room for the bag to be removed. A plastic liner system is imbedded into the main body of the container making it a sanitary system so that any liquid is not spilled out onto the floor.
    Type: Application
    Filed: June 18, 2014
    Publication date: December 24, 2015
    Inventor: Jeffrey Coffin
  • Publication number: 20070239418
    Abstract: Systems and methods for parallel, discrete, simulations include functional capabilities to incorporate one or more human operators or actors into the simulation process. Such individuals can be presented situations where one or more decisions are necessary with respect to ongoing events. Entered decisions are incorporated into simulated events and activities being simulated. These in turn influence the behavior of those entities and also initiate the occurrence of other time-based processes. An architecture artifact or product can be automatically created or updated by recording how a sequence of events took place. The creation of sections of the DoDAF OV-6C Operational Event Trace architectural diagram, for the executable architecture model, can be automatically performed to dynamically provide event traces in response to a live exercise.
    Type: Application
    Filed: March 23, 2007
    Publication date: October 11, 2007
    Inventors: Gregory Harrison, Salaheddine Saidi, Russell Chan, Ann McCauslin, Howard Kern, Jeffrey Coffin, David Benjamin, Lawrence Elliott, Christopher Young, Stephen Peckham, Michael Stewart, Mark Barbustiak
  • Publication number: 20070236890
    Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
    Type: Application
    Filed: June 5, 2007
    Publication date: October 11, 2007
    Inventors: Jeffrey Coffin, Michael Gaynes, David Questad, Kamal Sikka, Hilton Toy, Jamil Wakil
  • Publication number: 20060268521
    Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
    Type: Application
    Filed: May 26, 2005
    Publication date: November 30, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jeffrey Coffin, Michael Gaynes, David Questad, Kamal Sikka, Hilton Toy, Jamil Wakil
  • Patent number: D733987
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: July 7, 2015
    Inventor: Jeffrey Coffin