Patents by Inventor Jeffrey D. Chamberlain

Jeffrey D. Chamberlain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966330
    Abstract: Examples described herein relate to processor circuitry to issue a cache coherence message to a central processing unit (CPU) cluster by selection of a target cluster and issuance of the request to the target cluster, wherein the target cluster comprises the cluster or the target cluster is directly connected to the cluster. In some examples, the selected target cluster is associated with a minimum number of die boundary traversals. In some examples, the processor circuitry is to read an address range for the cluster to identify the target cluster using a single range check over memory regions including local and remote clusters. In some examples, issuance of the cache coherence message to a cluster is to cause the cache coherence message to traverse one or more die interconnections to reach the target cluster.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Vinit Mathew Abraham, Jeffrey D. Chamberlain, Yen-Cheng Liu, Eswaramoorthi Nallusamy, Soumya S. Eachempati
  • Patent number: 11958888
    Abstract: Nucleotide sequences including a micro-dystrophin gene are provided. The micro-dystrophin genes may be operatively linked to a regulatory cassette. Methods of treating a subject having, or at risk of developing, muscular dystrophy, sarcopenia, heart disease, or cachexia are also provided. The methods may include administering a pharmaceutical composition including the micro-dystrophin gene and a delivery vehicle to a subject. Further, the methods may include administering the pharmaceutical composition a subject having Duchenne muscular dystrophy or Becker muscular dystrophy.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: April 16, 2024
    Assignee: University of Washington
    Inventors: Jeffrey S. Chamberlain, Julian Ramos, Stephen D. Hauschka
  • Patent number: 11922220
    Abstract: Embodiments of systems, apparatuses and methods provide enhanced function as a service (FaaS) to users, e.g., computer developers and cloud service providers (CSPs). A computing system configured to provide such enhanced FaaS service include one or more controls architectural subsystems, software and orchestration subsystems, network and storage subsystems, and security subsystems. The computing system executes functions in response to events triggered by the users in an execution environment provided by the architectural subsystems, which represent an abstraction of execution management and shield the users from the burden of managing the execution. The software and orchestration subsystems allocate computing resources for the function execution by intelligently spinning up and down containers for function code with decreased instantiation latency and increased execution scalability while maintaining secured execution.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: March 5, 2024
    Assignee: Intel Corporation
    Inventors: Mohammad R. Haghighat, Kshitij Doshi, Andrew J. Herdrich, Anup Mohan, Ravishankar R. Iyer, Mingqiu Sun, Krishna Bhuyan, Teck Joo Goh, Mohan J. Kumar, Michael Prinke, Michael Lemay, Leeor Peled, Jr-Shian Tsai, David M. Durham, Jeffrey D. Chamberlain, Vadim A. Sukhomlinov, Eric J. Dahlen, Sara Baghsorkhi, Harshad Sane, Areg Melik-Adamyan, Ravi Sahita, Dmitry Yurievich Babokin, Ian M. Steiner, Alexander Bachmutsky, Anil Rao, Mingwei Zhang, Nilesh K. Jain, Amin Firoozshahian, Baiju V. Patel, Wenyong Huang, Yeluri Raghuram
  • Patent number: 11899615
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20230169032
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 1, 2023
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 11586579
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: February 21, 2023
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Patent number: 11294852
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20220050805
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Publication number: 20210374848
    Abstract: Systems, methods, and apparatuses for resource bandwidth monitoring and control are described. For example, in some embodiments, an apparatus comprising a requestor device to send a credit based request, a receiver device to receive and consume the credit based request, and a delay element in a return path between the requestor and receiver devices, the delay element to delay a credit based response from the receiver to the requestor are detailed.
    Type: Application
    Filed: August 13, 2021
    Publication date: December 2, 2021
    Inventors: Andrew HERDRICH, Edwin VERPLANKE, Ravishankar IYER, Christopher GIANOS, Jeffrey D. CHAMBERLAIN, Ronak SINGH, Julius MANDELBLAT, Bret Toll
  • Publication number: 20210263779
    Abstract: Embodiments of systems, apparatuses and methods provide enhanced function as a service (FaaS) to users, e.g., computer developers and cloud service providers (CSPs). A computing system configured to provide such enhanced FaaS service include one or more controls architectural subsystems, software and orchestration subsystems, network and storage subsystems, and security subsystems. The computing system executes functions in response to events triggered by the users in an execution environment provided by the architectural subsystems, which represent an abstraction of execution management and shield the users from the burden of managing the execution. The software and orchestration subsystems allocate computing resources for the function execution by intelligently spinning up and down containers for function code with decreased instantiation latency and increased execution scalability while maintaining secured execution.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 26, 2021
    Applicant: Intel Corporation
    Inventors: Mohammad R. Haghighat, Kshitij Doshi, Andrew J. Herdrich, Anup Mohan, Ravishankar R. Iyer, Mingqiu Sun, Krishna Bhuyan, Teck Joo Goh, Mohan J. Kumar, Michael Prinke, Michael Lemay, Leeor Peled, Jr-Shian Tsai, David M. Durham, Jeffrey D. Chamberlain, Vadim A. Sukhomlinov, Eric J. Dahlen, Sara Baghsorkhi, Harshad Sane, Areg Melik-Adamyan, Ravi Sahita, Dmitry Yurievich Babokin, Ian M. Steiner, Alexander Bachmutsky, Anil Rao, Mingwei Zhang, Nilesh K. Jain, Amin Firoozshahian, Baiju V. Patel, Wenyong Huang, Yeluri Raghuram
  • Publication number: 20210073129
    Abstract: Examples described herein relate to a manner of demoting multiple cache lines to shared memory. In some examples, a shared cache is accessible by at least two processor cores and a region of the cache is larger than a cache line and is designated for demotion from the cache to the shared cache. In some examples, the cache line corresponds to a memory address in a region of memory. In some examples, an indication that the region of memory is associated with a cache line demote operation is provided in an indicator in a page table entry (PTE). In some examples, the indication that the region of memory is associated with a cache line demote operation is based on a command in an application executed by a processor. In some examples, the cache is an level 1 (L1) or level 2 (L2) cache.
    Type: Application
    Filed: October 30, 2020
    Publication date: March 11, 2021
    Inventors: Rahul R. SHAH, Omkar MASLEKAR, Priya AUTEE, Edwin VERPLANKE, Andrew J. HERDRICH, Jeffrey D. CHAMBERLAIN
  • Patent number: 10936490
    Abstract: Method and apparatus for per-agent control and quality of service of shared resources in a chip multiprocessor platform is described herein. One embodiment of a system includes: a plurality of core and non-core requestors of shared resources, the shared resources to be provided by one or more resource providers, each of the plurality of core and non-core requestors to be associated with a resource-monitoring tag and a resource-control tag; a mapping table to store the resource monitoring and control tags associated with each non-core requestor; and a tagging circuitry to receive a resource request sent from a non-core requestor to a resource provider, the tagging circuitry to responsively modify the resource request to include the resource-monitoring and resource-control tags associated with the non-core requestor in accordance to the mapping table and send the modified resource request to the resource provider.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Andrew J. Herdrich, Edwin Verplanke, Stephen R. Van Doren, Ravishankar Iyer, Eric R. Wehage, Rupin H. Vakharwala, Rajesh M. Sankaran, Jeffrey D. Chamberlain, Julius Mandelblat, Yen-Cheng Liu, Stephen T. Palermo, Tsung-Yuan C. Tai
  • Publication number: 20200334196
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 10795853
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20200301830
    Abstract: Examples described herein relate to processor circuitry to issue a cache coherence message to a central processing unit (CPU) cluster by selection of a target cluster and issuance of the request to the target cluster, wherein the target cluster comprises the cluster or the target cluster is directly connected to the cluster. In some examples, the selected target cluster is associated with a minimum number of die boundary traversals. In some examples, the processor circuitry is to read an address range for the cluster to identify the target cluster using a single range check over memory regions including local and remote clusters. In some examples, issuance of the cache coherence message to a cluster is to cause the cache coherence message to traverse one or more die interconnections to reach the target cluster.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Inventors: Vinit MATHEW ABRAHAM, Jeffrey D. CHAMBERLAIN, Yen-Cheng LIU, Eswaramoorthi NALLUSAMY, Soumya S. EACHEMPATI
  • Patent number: 10705961
    Abstract: A processor includes a cache-side address monitor unit corresponding to a first cache portion of a distributed cache that has a total number of cache-side address monitor storage locations less than a total number of logical processors of the processor. Each cache-side address monitor storage location is to store an address to be monitored. A core-side address monitor unit corresponds to a first core and has a same number of core-side address monitor storage locations as a number of logical processors of the first core. Each core-side address monitor storage location is to store an address, and a monitor state for a different corresponding logical processor of the first core. A cache-side address monitor storage overflow unit corresponds to the first cache portion, and is to enforce an address monitor storage overflow policy when no unused cache-side address monitor storage location is available to store an address to be monitored.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Yen-Cheng Liu, Bahaa Fahim, Erik G. Hallnor, Jeffrey D. Chamberlain, Stephen R. Van Doren, Antonio Juan
  • Patent number: 10339060
    Abstract: System, method, and processor for enabling early deallocation of tracker entries which track memory accesses are described herein. One embodiment of a method includes: maintaining an RSF corresponding to a first processing unit of a plurality of processing units to track cache lines, wherein a cache line is tracked by the RSF if the cache line is stored in both a memory and one or more other processing unit, the memory is coupled to and shared by the plurality of processing units; receiving a request to access a target cache line from a processing core of the first processing unit; allocating a tracker entry corresponding to the request, the tracker entry used to track a status of the request; performing a lookup in the RSF for the target cache line; and deallocating the tracker entry responsive to a detection that the target cache line is not tracked the RSF.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: July 2, 2019
    Assignee: Intel Corporation
    Inventors: Bahaa Fahim, Ashok Jagannathan, Jeffrey D. Chamberlain, Samuel D. Strom
  • Patent number: 10338974
    Abstract: A starvation mode is entered and a particular dependency of a first request in a retry queue is identified. The particular dependency is determined to be acquired and the first request is retried based on acquisition of the particular dependency.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: July 2, 2019
    Assignee: Intel Corporation
    Inventors: Bahaa Fahim, Yen-Cheng Liu, Jeffrey D. Chamberlain
  • Patent number: 10204049
    Abstract: Methods and apparatus relating to improving the value of F-state by increasing a local caching agent's data forwarding are described. In one embodiment, the opportunity for forwarding from a local caching agent is improved by allowing the local caching agent to keep an F-state copy of the line while sending an S-state copy to the requestor (e.g., in response to a non-ownership read operation). Other embodiments are also disclosed.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: February 12, 2019
    Assignee: Intel Corporation
    Inventors: Vedaraman Geetha, Jeffrey D. Chamberlain, Sailesh Kottapalli, Ganesh Kumar, Henk G. Neefs, Neil J. Achtman, Bongjin Jung
  • Publication number: 20180373633
    Abstract: Method and apparatus for per-agent control and quality of service of shared resources in a chip multiprocessor platform is described herein. One embodiment of a system includes: a plurality of core and non-core requestors of shared resources, the shared resources to be provided by one or more resource providers, each of the plurality of core and non-core requestors to be associated with a resource-monitoring tag and a resource-control tag; a mapping table to store the resource monitoring and control tags associated with each non-core requestor; and a tagging circuitry to receive a resource request sent from a non-core requestor to a resource provider, the tagging circuitry to responsively modify the resource request to include the resource-monitoring and resource-control tags associated with the non-core requestor in accordance to the mapping table and send the modified resource request to the resource provider.
    Type: Application
    Filed: June 27, 2017
    Publication date: December 27, 2018
    Inventors: Andrew J. Herdrich, Edwin Verplanke, Stephen R. Van Doren, Ravishankar Iyer, Eric R. Wehage, Rupin H. Vakharwala, Rajesh M. Sankaran, Jeffrey D. Chamberlain, Julius Mandelblat, Yen-Cheng Liu, Stephen T. Palermo, Tsung-Yuan C. Tai