Abstract: A method of sputter coating a glass substrate includes providing a glass substrate and providing a sputtering assembly for sputtering a coating onto the glass substrate in a vacuum deposition chamber. The sputtering assembly includes a backing plate and a separating element disposed on the backing plate. At least one target element is provided and disposed at and in contact with a surface of the separating element. The target element is not bonded the separating element when disposed at and in contact with the surface of the separating element. An expansion gap is provided at or adjacent to the target element to allow for expansion of the target element during the sputtering process. Material from the target element is sputtered and the target element is heated to a substantially elevated temperature during the sputtering process. The sputtering process coats a surface of the glass substrate with the target element material.

Abstract: A method of sputter coating a glass substrate includes providing a glass substrate and providing a sputtering assembly for sputtering a coating onto the glass substrate in a vacuum deposition chamber. The sputtering assembly includes a backing plate and a separating element disposed on the backing plate. At least one target element is provided and disposed at and in contact with a surface of the separating element. The target element is not bonded the separating element when disposed at and in contact with the surface of the separating element. An expansion gap is provided at or adjacent to the target element to allow for expansion of the target element during the sputtering process. Material from the target element is sputtered and the target element is heated to a substantially elevated temperature during the sputtering process. The sputtering process coats a surface of the glass substrate with the target element material.

Abstract: A system and method for sputtering a coating onto a glass substrate in a vacuum deposition chamber includes providing a backing plate with a separating element disposed at the backing plate. At least one target element or tile is disposed on a surface of the separating element, wherein an expansion gap is provided to allow for expansion of the target relative to the separating element during the sputtering process. The method includes sputtering material from the target and heating the target to a substantially elevated temperature during the sputtering process. The separating element may be a sheet having a low-coefficient of friction surface, and the target may be disposed on the low-coefficient of friction surface of the separating element. The separating element may thermally insulate the target from the backing plate, whereby the target may be heated to a substantially greater temperature than the backing plate during the sputtering process.

Abstract: A variable reflectance rearview mirror reflective element assembly includes a front substrate having a first surface and a second surface, and a rear substrate having a third surface and a fourth surface, with the third surface having a conductive coating disposed thereat. A perimeter seal is disposed between and spaces apart the front and rear substrates and forms an interpane cavity therebetween. The perimeter seal has a gap between terminal ends thereof to provide a fill port for the mirror reflective element assembly when the front and rear substrates are mated together. A filter element is disposed at the fill port at least during a cavity filling process, and the filter element allows an electro-optic medium to flow therethrough during the cavity filling process and limits passage of debris, contaminants and/or particles to limit intrusion of debris, contaminants and/or particles into the interpane cavity during the cavity filling process.

Abstract: A system and method for sputtering a coating onto a glass substrate in a vacuum deposition chamber includes providing a backing plate with a separating element disposed at the backing plate. At least one target element or tile is disposed on a surface of the separating element, wherein an expansion gap is provided to allow for expansion of the target relative to the separating element during the sputtering process. The method includes sputtering material from the target and heating the target to a substantially elevated temperature during the sputtering process. The separating element may be a sheet having a low-coefficient of friction surface, and the target may be disposed on the low-coefficient of friction surface of the separating element. The separating element may thermally insulate the target from the backing plate, whereby the target may be heated to a substantially greater temperature than the backing plate during the sputtering process.