Patents by Inventor Jeffrey D. Weinhold
Jeffrey D. Weinhold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240075720Abstract: The present disclosure provides a multilayer film. The multilayer film includes at least two layers including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.900 g/cc to 0.925 g/cc and a melt index from 0.5 g/10 min to 30 g/10 min; and (B) a polyethylene-polydimethylsiloxane block copolymer having a weight average molecular weight from 1,000 g/mol to 10,000 g/mol. The second layer contains a second ethylene-based polymer.Type: ApplicationFiled: October 25, 2023Publication date: March 7, 2024Inventors: Rahul Sharma, Jeffrey D. Weinhold, Phillip D. Hustad, Megan E. Donaldson, Xiaoyong Li, Joseph C. Neuman, Yang Yang
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Patent number: 11466147Abstract: The present disclosure provides a composition containing a polymeric blend. The polymeric blend contains (A) from 50 wt % to 90 wt % of a first ethylene-based polymer having a density from 0.895 g/cc to 0.905 g/cc; and a melt index from 0.1 g/10 min to 50 g/10 min; (B) from 8 wt % to 48 wt % of a second ethylene-based polymer having a density from 0.935 g/cc to 0.967 g/cc; and a melt index from 0.1 g/10 min to 180 g/10 min; and from 0.01 wt % to 2.0 wt % of a slip agent, based on the total weight of the polymeric blend. The polymeric blend has (i) an overall density from 0.900 g/cc to 0.925 g/cc; and (ii) a coefficient of friction (COF) after aging for 1 week at 60° C. from 0.001 to 0.400. The present disclosure also provides a multilayer film with a first layer containing the composition.Type: GrantFiled: June 4, 2018Date of Patent: October 11, 2022Assignee: Dow Global Technologies LLCInventors: Rahul Sharma, Jong-Young Lee, Jeffrey D. Weinhold, Mridula Babli Kapur
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Publication number: 20220049377Abstract: Disclosed is a curly fiber having a fiber centroid and comprising a first region having a first centroid and a second region wherein the first region comprises an ethylene/alpha olefin interpolymer composition in an amount of at least 75 weight percent based on total weight of the first region and wherein the ethylene/alpha olefin interpolymer composition is characterized by a low temperature peak and a high temperature peak on an elution profile via improved comonomer composition distribution (ICCD) procedure, and a full width at half maximum of the high temperature peak is less than 6.0° C. and the second region is a material comprising a polymer which is different from the ethylene/alpha-olefin interpolymer of the first region and wherein the regions are arranged such that at least one of the first centroid and the second centroid is not the same as the fiber centroid.Type: ApplicationFiled: November 20, 2019Publication date: February 17, 2022Inventors: Yinglong CHEN, Akanksha GARG, Yijian LIN, Sanjib BISWAS, Jeffrey D. WEINHOLD, Pavan Kumar VALAVALA, Fabricio Arteaga LARIOS, Jill MARTIN, Didem ONER-DELIORMANLI, Mehmet DEMIRORS
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Publication number: 20220032588Abstract: The present disclosure provides a multilayer film. The multilayer film includes at least two layers including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.900 g/cc to 0.925 g/cc and a melt index from 0.5 g/10 min to 30 g/10 min; and (B) a polyethylene-polydimethylsiloxane block copolymer having a weight average molecular weight from 1,000 g/mol to 10,000 g/mol. The second layer contains a second ethylene-based polymer.Type: ApplicationFiled: December 10, 2019Publication date: February 3, 2022Inventors: Rahul Sharma, Jeffrey D. Weinhold, Phillip D. Hustad, Megan E. Donaldson, Xiaoyong Li, Joseph C. Neuman, Yang Yang
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Publication number: 20200131351Abstract: The present disclosure provides a composition containing a polymeric blend. The polymeric blend contains (A) from 50 wt % to 90 wt % of a first ethylene-based polymer having a density from 0.895 g/cc to 0.905 g/cc; and a melt index from 0.1 g/10 min to 50 g/10 min; (B) from 8 wt % to 48 wt % of a second ethylene-based polymer having a density from 0.935 g/cc to 0.967 g/cc; and a melt index from 0.1 g/10 min to 180 g/10 min; and from 0.01 wt % to 2.0 wt % of a slip agent, based on the total weight of the polymeric blend. The polymeric blend has (i) an overall density from 0.900 g/cc to 0.925 g/cc; and (ii) a coefficient of friction (COF) after aging for 1 week at 60° C. from 0.001 to 0.400. The present disclosure also provides a multilayer film with a first layer containing the composition.Type: ApplicationFiled: June 4, 2018Publication date: April 30, 2020Inventors: Rahul Sharma, Jong-Young Lee, Jeffrey D. Weinhold, Mridula Babli Kapur
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Patent number: 10287455Abstract: Disclosed herein is an article comprising a substrate; upon which is disposed a composition comprising: a first block copolymer that comprises a first block and a second block; where the first block has a higher surface energy than the second block; a second block copolymer that comprises a first block and a second block; where the first block of the first block copolymer is chemically the same as or similar to the first block of the second block copolymer and the second block of the first block copolymer is chemically the same as or similar to the second block of the second block copolymer; where the first and the second block copolymer have a chi parameter greater than 0.04 at a temperature of 200° C.Type: GrantFiled: April 24, 2017Date of Patent: May 14, 2019Assignees: DOW GLOBAL TECHNOLOGIES LLC, ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Jieqian Zhang, Phillip D. Hustad, Peter Trefonas, III, Mingqi Li, Valeriy V. Ginzburg, Jeffrey D. Weinhold
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Patent number: 10208193Abstract: Embodiments of the invention provide a reinforced polypropylene comprising a multi-modal molecular weight distribution elastomer and a block composite.Type: GrantFiled: June 24, 2013Date of Patent: February 19, 2019Assignee: Dow Global Technologies LLCInventors: Yi Jin, Kim L. Walton, Edmund M. Carnahan, Gary R. Marchand, Xuming Chen, Jeffrey D. Weinhold, Jerzy Klosin, A. Willem Degroot, Philip P. Fontaine
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Publication number: 20180340045Abstract: The present invention provides polymer compositions of one or more phosphorus acid group containing, polymers of six-membered cyclic methacrylic acid imide comprising a backbone polymer having one or more one methacrylic acid in polymerized form or its salt, quaternary ammonium group, ester side chain group or amide side chain group, wherein the backbone polymers comprise from 60 to 100 wt. %, based on the total weight of monomers used to make the backbone polymer, of total methacrylic acid polymerized units, regardless of their form, and wherein a total of from 7.5 to 95 wt. %, or, preferably, less than 70 wt. % of the methacrylic acid polymerized units comprise methacrylic anhydride groups or six-membered cyclic methacrylic imide groups. The polymer can be readily tailored to boost modulus and modify surface energies when added to polymers like polyolefins, and to make them compatible with other polymers, like polyamide.Type: ApplicationFiled: December 9, 2015Publication date: November 29, 2018Inventors: Charles J. Rand, Ryan J. DePuit, William J. Harris, Thomas Oswald, C. Damien Rodowski, Jeffrey D. Weinhold
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Publication number: 20170369371Abstract: The present invention provides comb polymer compositions comprising phosphorus acid group containing backbone polymers of six-membered cyclic methacrylic imide having one or more side chain ether group containing N-substituent chosen from an ether group, a polyether group, an etheramine group, a polyetheramine group, an ether group crosslinking the backbone polymer chains, and a polyether group crosslinking the backbone polymer chains. The backbone polymers comprise from 60 to 100 wt. %, based on the total weight of monomers used to make the backbone polymer, of methacrylic acid polymerized units, regardless of their form, and from 7.5 to 95 wt. % of such polymerized units as methacrylic anhydride groups or six-membered cyclic methacrylic imide groups.Type: ApplicationFiled: December 22, 2014Publication date: December 28, 2017Inventors: William J. Harris, Thomas Oswald, Charles J. Rand, Jeffrey D. Weinhold
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Publication number: 20170362365Abstract: The present invention provides amphiphilic comb polymer compositions of phosphorus acid group containing backbone polymers of methacrylic anhydride having hydrophobic alkyl, aryl, cycloalkyl or polyolefin ester or amide side chain groups formed on the backbone polymers and comprising from 75 to 100 wt. %, based on the total weight of monomers used to make the backbone polymer, of methacrylic acid polymerized units, wherein in the backbone polymer from 20 to less than 70 wt. %, preferably from 50 to 67 wt. % of the methacrylic acid polymerized units comprise methacrylic anhydride groups as determined by titration of the backbone polymer. As polymeric additives, the polymers can compatibilize polyolefins and polar polymers like polyesters.Type: ApplicationFiled: December 9, 2015Publication date: December 21, 2017Inventors: Charles J. Rand, Kebede Beshah, William J. Harris, Thomas Oswald, Jeffrey D. Weinhold
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Patent number: 9735023Abstract: Disclosed herein is a composition comprising a first block copolymer that comprises a first block and a second block; where the first block has a higher surface energy than the second block; a second block copolymer that comprises a first block and a second block; where the first block of the first block copolymer is chemically the same as or similar to the first block of the second block copolymer and the second block of the first block copolymer is chemically the same as or similar to the second block of the second block copolymer; where the weight percent based on total solids of the first block of the second block copolymer is greater than that of the first block of the first block copolymer; where the first block copolymer phase separates into a first morphology of cylindrical or lamellar domains when disposed singly on a substrate.Type: GrantFiled: June 22, 2015Date of Patent: August 15, 2017Assignees: DOW GLOBAL TECHNOLOGIES LLC, ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Jieqian Zhang, Phillip D. Hustad, Peter Trefonas, III, Mingqi Li, Valeriy V. Ginzburg, Jeffrey D. Weinhold
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Publication number: 20170226379Abstract: Disclosed herein is an article comprising a substrate; upon which is disposed a composition comprising: a first block copolymer that comprises a first block and a second block; where the first block has a higher surface energy than the second block; a second block copolymer that comprises a first block and a second block; where the first block of the first block copolymer is chemically the same as or similar to the first block of the second block copolymer and the second block of the first block copolymer is chemically the same as or similar to the second block of the second block copolymer; where the first and the second block copolymer have a chi parameter greater than 0.04 at a temperature of 200° C.Type: ApplicationFiled: April 24, 2017Publication date: August 10, 2017Inventors: Jieqian Zhang, Phillip D. Hustad, Peter Trefonas, III, Mingqi Li, Valeriy V. Ginzburg, Jeffrey D. Weinhold
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Patent number: 9663682Abstract: Disclosed herein is an article comprising a substrate; upon which is disposed a composition comprising: a first block copolymer that comprises a first block and a second block; where the first block has a higher surface energy than the second block; a second block copolymer that comprises a first block and a second block; where the first block of the first block copolymer is chemically the same as or similar to the first block of the second block copolymer and the second block of the first block copolymer is chemically the same as or similar to the second block of the second block copolymer; where the first and the second block copolymer have a chi parameter greater than 0.04 at a temperature of 200° C.Type: GrantFiled: June 22, 2015Date of Patent: May 30, 2017Assignees: DOW GLOBAL TECHNOLOGIES LLC, ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Jieqian Zhang, Phillip D. Hustad, Peter Trefonas, III, Mingqi Li, Valeriy V. Ginzburg, Jeffrey D. Weinhold
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Patent number: 9475928Abstract: The present disclosure provides a composition comprising: a) a polypropylene; b) a polyolefin elastomer; and c) a block composite. The polyolefin elastomer has an I10/I2 from greater than 7.5 to 15.0. The composition may optionally include a filler.Type: GrantFiled: December 31, 2013Date of Patent: October 25, 2016Assignee: Dow Global Technologies LLCInventors: Yi Jin, Xuming X. Chen, Kim L. Walton, Gary R. Marchand, Jeffrey D. Weinhold, Sylvie Vervoort
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Publication number: 20160251505Abstract: Embodiments of the invention provide a reinforced polypropylene comprising a multi-modal molecular weight distribution elastomer and a block composite.Type: ApplicationFiled: June 24, 2013Publication date: September 1, 2016Applicant: Dow Global Technologies LLCInventors: Yi Jin, Kim L. Walton, Edmund M. Carnahan, Gary R. Marchand, Xuming Chen, Jeffrey D. Weinhold, Jerzy Klosin, A. Willem Degroot, Philip P. Fontaine
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Publication number: 20150376454Abstract: Disclosed herein is an article comprising a substrate; upon which is disposed a composition comprising: a first block copolymer that comprises a first block and a second block; where the first block has a higher surface energy than the second block; a second block copolymer that comprises a first block and a second block; where the first block of the first block copolymer is chemically the same as or similar to the first block of the second block copolymer and the second block of the first block copolymer is chemically the same as or similar to the second block of the second block copolymer; where the first and the second block copolymer have a chi parameter greater than 0.04 at a temperature of 200° C.Type: ApplicationFiled: June 22, 2015Publication date: December 31, 2015Inventors: Jieqian Zhang, Phillip D. Hustad, Peter Trefonas, III, Mingqi Li, Valeriy V. Ginzburg, Jeffrey D. Weinhold
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Publication number: 20150376408Abstract: Disclosed herein is a composition comprising a first block copolymer that comprises a first block and a second block; where the first block has a higher surface energy than the second block; a second block copolymer that comprises a first block and a second block; where the first block of the first block copolymer is chemically the same as or similar to the first block of the second block copolymer and the second block of the first block copolymer is chemically the same as or similar to the second block of the second block copolymer; where the weight percent based on total solids of the first block of the second block copolymer is greater than that of the first block of the first block copolymer; where the first block copolymer phase separates into a first morphology of cylindrical or lamellar domains when disposed singly on a substrate.Type: ApplicationFiled: June 22, 2015Publication date: December 31, 2015Inventors: Jieqian Zhang, Phillip D. Hustad, Peter Trefonas, III, Mingqi Li, Valeriy V. Ginzburg, Jeffrey D. Weinhold
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Patent number: 8961918Abstract: A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(dimethylsiloxane) block copolymer component to a surface of the substrate; optionally, baking the film; subjecting the film to a high temperature annealing process under particularized atmospheric conditions for a specified period of time; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(dimethylsiloxane) in the annealed film to SiOx.Type: GrantFiled: February 10, 2012Date of Patent: February 24, 2015Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Shih-Wei Chang, Jeffrey D. Weinhold, Phillip D. Hustad, Peter Trefonas
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Publication number: 20140378601Abstract: The present disclosure provides a composition comprising: a) a polypropylene; b) a polyolefin elastomer; and c) a block composite. The polyolefin elastomer has an I10/I2 from greater than 7.5 to 15.0. The composition may optionally include a filler.Type: ApplicationFiled: December 31, 2013Publication date: December 25, 2014Applicant: Dow Global Technologies LLCInventors: Yi Jin, Xuming X. Chen, Kim L. Walton, Gary R. Marchand, Jeffrey D. Weinhold, Sylvie Veroort
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Patent number: 8821739Abstract: A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(siloxane) block copolymer component; and, an antioxidant to a surface of the substrate; optionally, baking the film; subjecting the film to a high temperature annealing process under a gaseous atmosphere for a specified period of time; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(siloxane) in the annealed film to SiOx.Type: GrantFiled: July 12, 2012Date of Patent: September 2, 2014Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Xinyu Gu, Shih-Wei Chang, Phillip D. Hustad, Jeffrey D. Weinhold, Peter Trefonas