Abstract: A method of manufacturing a sputtering target includes the steps of providing a backing structure, providing target material comprising ceramic target material for spraying, subsequently thermal spraying the target material over the backing structure thus providing a target product where at least 40% in mass, for example at least 50% in mass, of the target material including a ceramic target material, and subsequently performing hot isostatic pressing on the target product thus increasing the density of the target material.

Abstract: A sputtering target includes at least one single piece with a length of at least 600 mm. The sputtering target has a backing structure provided with target material for sputtering. At least 40% of the mass of the target material includes a so-called target volatile material which shows, at pressures between 700 hPa and 1300 hPa, either a sublimation temperature, or decomposition temperature below its melting point or a melting temperature and an absolute boiling temperature being close to each other. The sputtering target has a target material density of at least 95% of the theoretical density of the target material. The sputtering target includes a bonding layer with a thickness of 0 to 500 ?m between the backing structure and the target material.