Abstract: A Control Neutron Absorber (CNA) assembly for a microreactor that produces nuclear energy is disclosed. The CNA assembly includes a housing, a CNA rod, and a burnable absorber. The housing includes an inner housing and an outer housing. The inner housing is configured to receive a CNA rod. The outer housing extends coaxially with the inner housing and is positioned radially outward and offset from the inner housing defining a cavity therebetween. The CNA rod includes a neutron absorbing rod including a first neutron absorbing material. The neutron absorbing rod is positioned within the inner housing and is configured to move axially relative to the inner housing. The burnable absorber includes a second neutron absorbing material, exhibits a neutron absorbing strength that is less than that of the neutron absorbing rod, is positioned within the inner housing, and is configured to receive the neutron absorbing rod therein.

Abstract: A method for the controllable dissolution of one or more alkali metals from a vessel containing a one or more alkali metals and/or one or more partially passivated alkali metals. The vessel preferably comprising a sodium, NaK or other alkali metal-cooled nuclear reactor that has been used. The alkali metal, preferably sodium, potassium or a combination thereof, in the vessel is exposed to a treatment liquid, preferably an acidic liquid, more preferably citric acid. Preferably, the treatment liquid is maintained in continuous motion relative to any surface of unreacted alkali metal with which the treatment liquid is in contact. The treatment liquid is preferably pumped into the vessel containing the one or more alkali metals and the resulting fluid is extracted and optionally further processed. Preferably, the resulting off-gases are processed by an off-gas treatment system and the resulting liquids are processed by a liquid disposal system.

Abstract: An apparatus, and a corresponding method, for chemically etching the copper foil of a copper foil-clad substrate are disclosed. Significantly, this apparatus includes fluid jet injectors which serve to produce jets of chemical etchant. These fluid jet injectors are arranged so as to simultaneously achieve a relatively high etch rate and a relatively high etch uniformity.