Abstract: In an optics system, a flexible mirror is deformed with an electromagnetic force. In one embodiment, an electrical current is directed through the mirror, or a conductor attached to the mirror, in the presence of a magnetic field. In one application in an adaptive optics system, the membrane mirror is used in a wavefront sensor. Deformed to oscillate between convex and concave positions, the mirror is used to alternately defocus a received light signal for determining aberrations in the light signal. By detecting aberrations in the light signal, the adaptive optics system can correct for those aberrations.

Abstract: A compliant RF feed system (10) that provides impedance matching for VHF/AM, VHF/FM, UHF and L-band frequencies. The feed system (70) includes a feed post (14) electrically connected to an antenna element (18) at one end and a matching circuit package (22) at an opposite end, where the feed post (14) extends across a non-conductive gap (16) between the antenna element (18) and a conductive aircraft component (20). The matching package (22) includes a compressible bellows (38) mounted in the package (22), where the feed post (14) contacts the bellows (38) in a compression engagement to provide an electrical connection between the feed post (14) and a RF matching circuit (24) in the matching package (22). An impedance transformer (40) is provided in the matching package (22) to match the impedance of the bellows (38) to the matching circuit (24). The bellows (38) allows the electrical connection between the antenna element (18) and the aircraft component (20) to accommodate vibrations during aircraft operation.

Abstract: A cavity-backed slot array antenna is provided which offers wide frequency bandwidth in a conformal structure and further offers forward horizon coverage and wide angle beam scanning. The slot array antenna has a plurality of cavity-backed slot arrays. Each array contains a plurality of conductive cavities and radiating slots. The conductive cavities have varying size length and width in accordance with a log-periodic scale and, some conductive cavities have a maximum constant width. The slots are preferably formed in a folded configuration extending along a substantial portion of the width of the conductive cavity and further extend along a portion of the length of the conductive cavity one or more times. For a conductive cavity at maximum width, the corresponding slots are further extended in the effective overall length so as to further extend the frequency bandwidth, while maintaining a compact antenna structure.

Abstract: A solderless right-angle interconnect is provided for achieving flexible, low-profile and enhanced performance high frequency signal interconnections. The interconnect includes a compressible conductive pin assembly which has a first end electrically coupled to a first transmission path and a second end electrically coupled to a stripline circuit trace which provides a second transmission path. According to one embodiment, a springy compressible conductive button is located in a recessed chamber at the second end of the conductive pin and partially extends from the end thereof. According to another embodiment, a springy conductive bellows is formed intermediate the first and second ends of the pin assembly. The second end of the conductive pin further includes at least one tapered edge. A conductive ground layer is further provided for substantially enclosing the interconnect and providing a ground reference thereabout.

Abstract: A dual cavity-backed slot antenna is provided which exhibits a relatively wide frequency bandwidth and dual resonant frequency capabilities. The antenna includes a first substrate board having a bottom conductive surface and a top surface with a conductive feedline etched thereon. A second substrate board is further included having a bottom surface which is bonded to the top surface of the first substrate board. The second substrate board has a top conductive surface with radiating slots etched thereon. First and second conductive cavities are provided which extend from the top conductive surface of the second substrate board to the bottom conductive surface of the first substrate board. Each of the first and second cavities enclose at least one of the radiating slots.

Abstract: A solderless right-angle interconnect is provided for achieving flexible, low-profile and enhanced performance high frequency signal interconnections. The interconnect includes a conductive pin which has a first end electrically coupled to a first transmission path and a second end electrically coupled to a stripline circuit trace which provides a second transmission path. A springy compressible conductive button is located in a recessed chamber at the second end of the conductive pin and partially extends from the end thereof. The second end of the conductive pin further includes at least one tapered edge. A conductive ground layer is further provided for substantially enclosing the interconnect and providing a ground reference thereabout. In a first embodiment, the conductor forming the first transmission path includes a coaxial cable coupled to the conductive pin.