Abstract: Systems and methods for air pressure control in a hot melt liquid dispensing system are described. An example hot melt liquid dispensing system includes a pump that pumps hot melt liquid to an applicator. The hot melt liquid dispensing system also includes an air flow path that supplies pressurized air to the pump and an electronic pressure sensor associated with the air flow path. The hot melt liquid dispensing system also includes a controller that receives an electronic signal from the electronic pressure sensor indicative of an air pressure in the air flow path and causes adjustment to the air pressure in the air flow path based on the electronic signal from the electronic pressure sensor.

Abstract: An adhesive dispensing device (10) includes a melt module (12) including a housing (78) that defines a receiving space to receive adhesive and a heater (114) to heat the housing to melt the adhesive, and a control module (14) releasably connected to the melt module. The control module includes a controller (36) to automatically recognize a characteristic associated with the melt module and operate the melt module using instructions stored on the controller that correspond to the characteristic of the melt module. A method of operating the adhesive dispensing device is also disclosed.

Abstract: Foam dispensing systems and methods are disclosed. Such systems and methods may include a foamed material dispenser, a dynamic mixer having a gas input, a process material input, and a foamed material output. The foamed material output may be in fluid communication with the foamed material dispenser. A pump having an output may be in fluid communication with the process material input of the dynamic mixer, and a gas injection valve may be in fluid communication with the gas input of the dynamic mixer. A gas pressure regulator may be coupled between the pressurized gas supply and the gas injection valve, and a gas injection cycle timer may be operatively connected to the gas injection valve, the gas injection cycle timer causing the gas injection valve to pulse open and closed to send pulses of pressurized gas into the dynamic mixer through the gas input.

Abstract: Foam dispensing systems and methods are disclosed. Such systems and methods may include a foamed material dispenser, a dynamic mixer having a gas input, a process material input, and a foamed material output. The foamed material output may be in fluid communication with the foamed material dispenser. A pump having an output may be in fluid communication with the process material input of the dynamic mixer, and a gas injection valve may be in fluid communication with the gas input of the dynamic mixer. A gas pressure regulator may be coupled between the pressurized gas supply and the gas injection valve, and a gas injection cycle timer may be operatively connected to the gas injection valve, the gas injection cycle timer causing the gas injection valve to pulse open and closed to send pulses of pressurized gas into the dynamic mixer through the gas input.

Abstract: An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.

Abstract: Foam dispensing systems and methods are disclosed. Such systems and methods may include a foamed material dispenser, a dynamic mixer having a gas input, a process material input, and a foamed material output. The foamed material output may be in fluid communication with the foamed material dispenser. A pump having an output may be in fluid communication with the process material input of the dynamic mixer, and a gas injection valve may be in fluid communication with the gas input of the dynamic mixer. A gas pressure regulator may be coupled between the pressurized gas supply and the gas injection valve, and a gas injection cycle timer may be operatively connected to the gas injection valve, the gas injection cycle timer causing the gas injection valve to pulse open and closed to send pulses of pressurized gas into the dynamic mixer through the gas input.

Abstract: Foam dispensing systems and methods are disclosed. Such systems and methods may include a foamed material dispenser, a dynamic mixer having a gas input, a process material input, and a foamed material output. The foamed material output may be in fluid communication with the foamed material dispenser. A pump having an output may be in fluid communication with the process material input of the dynamic mixer, and a gas injection valve may be in fluid communication with the gas input of the dynamic mixer. A gas pressure regulator may be coupled between the pressurized gas supply and the gas injection valve, and a gas injection cycle timer may be operatively connected to the gas injection valve, the gas injection cycle timer causing the gas injection valve to pulse open and closed to send pulses of pressurized gas into the dynamic mixer through the gas input.

Abstract: An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.

Abstract: An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.

Abstract: An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.

Abstract: A hot melt adhesive dispensing unit includes an adhesive supply for receiving solid or semi-solid hot melt adhesive material, an adhesive supply heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive material into a liquid hot melt adhesive material, a manifold connected to the adhesive supply, a pump connected to the manifold for pumping the liquid hot melt adhesive from the adhesive supply into the manifold, a controller connected to the adhesive supply heater and the pump, and a user interface connected to the controller. The user interface is for providing information about and control over heating and pumping functions of the hot melt adhesive dispensing unit, and the controller controls the adhesive supply heater and the pump.