Patents by Inventor Jeffrey Eames Christensen

Jeffrey Eames Christensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a microelectronic device package
    Patent number: 5928598
    Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
    Type: Grant
    Filed: May 9, 1997
    Date of Patent: July 27, 1999
    Assignee: Motorola, Inc.
    Inventors: Michael John Anderson, Gary Carl Johnson, Mark Phillip Popovich, Jeffrey Eames Christensen
  • Microelectronic device package and method
    Patent number: 5702775
    Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
    Type: Grant
    Filed: December 26, 1995
    Date of Patent: December 30, 1997
    Assignee: Motorola, Inc.
    Inventors: Michael John Anderson, Gary Carl Johnson, Mark Phillip Popovich, Jeffrey Eames Christensen