Patents by Inventor Jeffrey Eisenmann

Jeffrey Eisenmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9413136
    Abstract: A laser module has a unitary base including stepped platforms with an offset relative to an adjacent platform, each stepped platform accommodating a laser source with at least a first and a second plurality of stepped platforms, each platform accommodating a cooling channel inside at a predetermined depth below the top surface of the platform to conduct a flow of cooling fluid provided on an inlet, the cooling channel running under a platform having microchannels, the cooling channels being connected to a fluid inlet with an inlet manifold that provides cooling fluid at the inlet and an outlet manifold to dispose the cooling fluid with waste heat at an outlet, the laser module producing in one embodiment no less than 100 Watt of optical power.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: August 9, 2016
    Assignee: Trumpf Photonics, Inc.
    Inventors: Thilo Vethake, Jeffrey Eisenmann, Stefan Heinemann
  • Publication number: 20030016440
    Abstract: An optical fiber oven encloses optical fibers, such as erbium doped fibers, and maintains an optimal temperature range for the fibers. The optical fiber oven includes a housing having fiber entrance holes and fiber exit holes allowing the fiber to enter and exit the housing. The fibers are positioned around a fiber hub within the housing to maintain the minimum bend radius of the optic fiber. A heating element and heat regulation device are mounted within the housing to maintain the optimal temperature.
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Applicant: Terra Worx, Inc.
    Inventors: Dany M. Zeidan, Jeffrey Eisenmann
  • Patent number: 6477053
    Abstract: A heat sink used in an electronic assembly includes mounting surfaces on a first side of a base portion and extended heat dissipating surfaces (e.g., fins) extending from a second side of the base portion. One or more electronic component boards, such as printed wiring boards (PWBs), are mounted to the mounting surfaces on the heat sink at one or more levels. Some of the mounting surfaces can be formed on mounting ridges, which define channels. Ventilation apertures located between the fins extend through the base portion such that air is drawn through the channels and up through the apertures creating a “chimney” effect. The heat sink is also grounded to at least one of the PWBS and electrically isolated from the chassis. Isolator bushings can be mounted in one or more of the fins for receiving pins extending from the chassis to insure mechanical support and isolation/dampening and to insure electrical isolation from the chassis.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: November 5, 2002
    Assignees: Tyco Telecommunications (US) Inc., TerraWorx, Inc.
    Inventors: Dany M. Zeidan, Jeffrey Eisenmann, David J. Maxham