Abstract: A method includes providing, within an etch chamber, a base structure including a target layer disposed on a substrate, and an etch mask disposed on the target layer, dry etching, within the etch chamber, the target layer using thionyl chloride to obtain a processed base structure, and after forming the plurality of features. The processed base structure includes a plurality of features and a plurality of openings defined by the etch mask. The method further includes removing the processed base structure from the etch chamber. In some embodiments, the target layer includes carbon. In some embodiments, the dry etching is performed at a sub-zero degree temperature.

Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.

Abstract: A physiology sensing device and an intelligent textile are provided. The physiology sensing device includes a fabric substrate and a conductive coating layer. The conductive coating layer is embedded from a side of the fabric substrate and leveled with the fabric body, and a thickness of the conductive coating layer is not larger than a thickness of the fabric substrate. The conductive coating layer includes a hydrophobic adhesive and a plurality of conductive particles distributing therein. The physiology sensing device receives variation of a signal of body potential on skin surface. Then a long range signal receiver receives the signal, the signal is shown on a monitory system so as to perform long distance monitoring.

Abstract: A video encoder includes a mode decision module that determines a final macroblock cost for each macroblock of the plurality of macroblocks based on costs associated with a plurality of motion vectors. An intra pulse code modulation (IPCM) module, when enabled, selects an IPCM mode when the final macroblock cost compares unfavorably to an IPCM threshold. A reconstruction module generates residual pixel values for each macroblock of the plurality of macroblocks and a transform and quantization module, transforms and quantizes the residual pixel values when the IPCM mode is not selected.

Abstract: A run-level coding module can be used in a video encoder that generates a processed video signal from a video input signal. The run-level coding module includes a run-level coder that generates a first plurality of run-level pairs from a first stream of quantized data. A first ring buffer buffers a first number of the first plurality of run-level pairs. The processed video signal is generated based on the buffered first number of run-level pairs.

Abstract: A run-level coding module can be used in a video encoder that generates a processed video signal from a video input signal. The run-level coding module includes a run-level coder that generates a first plurality of run-level pairs from a first stream of quantized data. A first ring buffer buffers a first number of the first plurality of run-level pairs. The processed video signal is generated based on the buffered first number of run-level pairs.

Abstract: A video encoder includes a mode decision module that determines a final macroblock cost for each macroblock of the plurality of macroblocks based on costs associated with a plurality of motion vectors. An intra pulse code modulation (IPCM) module, when enabled, selects an IPCM mode when the final macroblock cost compares unfavorably to an IPCM threshold. A reconstruction module generates residual pixel values for each macroblock of the plurality of macroblocks and a transform and quantization module, transforms and quantizes the residual pixel values when the IPCM mode is not selected.

Abstract: An LGA socket (1) includes an insulative housing (2) and a plurality of conductive contacts (3) received in the housing. The housing defines a recessed area (25) surrounded by a number of sidewalls (21). The contacts are received in the recessed area. Each of the sidewall defines a plurality of slots (27) and a plurality of corresponding shielding terminals (4) fastened in the slots. Each shielding terminal includes a fastening portion (41), a linking portion (43) extending from the fastening portion, a first contacting arm (421) extending from one end of the linking portion, and a second contacting arm (422) extending form the other end of the linking portion. The first and second contacting arms dispose out of the sots for elastically connecting with external components.

Abstract: An LGA socket (1) includes an insulative housing (2) and a plurality of conductive contacts (3) received in the housing. The housing defines a recessed area (25) surrounded by a number of sidewalls (21). The contacts are received in the recessed area. Each of the sidewall defines a plurality of slots (27) and a plurality of corresponding shielding terminals (4) fastened in the slots. Each shielding terminal includes a fastening portion (41), a linking portion (43) extending from the fastening portion, a first contacting arm (421) extending from one end of the linking portion, and a second contacting arm (422) extending form the other end of the linking portion. The first and second contacting arms dispose out of the sots for elastically connecting with external components.

Abstract: An LGA socket (1) includes an insulative housing (2) and a plurality of conductive contacts (3) received in the housing. The housing defines a recessed area (25) surrounded by a number of sidewalls (21). The contacts are received in the recessed area. Each of the sidewall defines a plurality of slots (27) and a plurality of corresponding shielding terminals (4) fastened in the slots. Each shielding terminal includes a fastening portion (41), a linking portion (43) extending from the fastening portion, a first contacting arm (421) extending from one end of the linking portion, and a second contacting arm (422) extending form the other end of the linking portion. The first and second contacting arms dispose out of the sots for elastically connecting with external components.

Abstract: A lighting device mounting apparatus allows the adjusting of the lighting device faceplate after the installation of a housing in a wall.

Abstract: According to an embodiment of the present invention, an LGA connector (10) for forming electrical connection between an LGA package and a circuit substrate includes a dielectric housing (20) defining a number of passages (2024) and a number of conductive terminals (30) seated in the corresponding passages, respectively. The dielectric housing is provided with a number of reinforced columns (2026) capable of being inserted into a number of recesses correspondingly defined in the circuit substrate, to favorably prevent the dielectric housing from being displaced relative to the circuit substrate.

Abstract: An LGA socket (1) includes an insulative housing (2) and a plurality of conductive contacts (3) received in the housing. The housing defines a recessed area (25) surrounded by a number of sidewalls (21). The contacts are received in the recessed area. Each of the sidewall defines a plurality of slots (27) and a plurality of corresponding shielding terminals (4) fastened in the slots. Each shielding terminal includes a fastening portion (41), a linking portion (43) extending from the fastening portion, a first contacting arm (421) extending from one end of the linking portion, and a second contacting arm (422) extending form the other end of the linking portion. The first and second contacting arms dispose out of the sots for elastically connecting with external components.

Abstract: According to an embodiment of the present invention, an LGA connector (10) for forming electrical connection between an LGA package and a circuit substrate includes a dielectric housing (20) defining a number of passages (2024) and a number of conductive terminals (30) seated in the corresponding passages, respectively. The dielectric housing is provided with a number of reinforced columns (2026) capable of being inserted into a number of recesses correspondingly defined in the circuit substrate, to favorably prevent the dielectric housing from being displaced relative to the circuit substrate.

Abstract: A new fermentation process for the culture of Neisseria meningitidis incorporates a wholly synthetic medium and event based processing decisions. This process is capable of generating cells at production scale for the extraction and purification of outer membrane protein complex (OMPC) vesicles which are useful as a protein carrier for PedvaxHIB.RTM. and pneumococcal conjugate vaccines.