Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. The apparatus may process semiconductor substrates with a selected diameter in a range from about 100 mm to about 450 mm.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. One or more multi-axis robot arms in the substrate transfer chamber may transfer semiconductor substrates between the load lock chamber and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store semiconductor substrates. A first set of one or more multi-axis robot arms may transfer one or more semiconductor substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer semiconductor substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store magnetic media substrates. A first set of one or more multi-axis robot arms may transfer one or more magnetic media substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer magnetic media substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a process chamber. A gas manifold is directly connected to an outer surface of the process chamber. The gas manifold may provide one or more gases to the process chamber.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store flat-panel display substrates. A first set of one or more multi-axis robot arms may transfer one or more flat-panel display substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer flat-panel display substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.