Abstract: A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be pre plated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups.

Abstract: A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be pre plated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups.

Abstract: A continuous method to make a prepreg with improved thermal conductivity and electrical properties for use in multilayer printed circuit boards.

Abstract: A multilayer circuit board comprising at least one substantially void free encapsulated heavy copper core and methods for producing such a board. Such a board may be formed by providing a first core that includes a substrate and heavy copper circuit traces, filling the spaces between circuit traces with a resin, and at least partially curing the resin so as to form two exposed and substantially planar surfaces on opposite sides of the core. The filled and planarized core is then laminated with additional dielectric layers to form a fully cured, void free multilayer printed circuit board.