Abstract: An example method includes obtaining annotated source code and based at least in part on a first annotation, separating the source code into first and second source code portions. The method also includes generating from the first source code portion a first source code stream to be supplied for compilation by a first compiler, the first source code stream augmented, based on the first annotation, to include additional coordination code not present in the obtained source code, and the first compiler specific to the first-type subset of the target CPUs. The method further includes generating from the second source code portion a second source code stream to be supplied for compilation by a second compiler, the second compiler specific to a second-type subset of the target CPUs. The target CPUs of the first- and second-type subsets have one or more different functionalities.

Abstract: An example method includes obtaining annotated source code and based at least in part on a first annotation, separating the source code into first and second source code portions. The method also includes generating from the first source code portion a first source code stream to be supplied for compilation by a first compiler, the first source code stream augmented, based on the first annotation, to include additional coordination code not present in the obtained source code, and the first compiler specific to the first-type subset of the target CPUs. The method further includes generating from the second source code portion a second source code stream to be supplied for compilation by a second compiler, the second compiler specific to a second-type subset of the target CPUs. The target CPUs of the first- and second-type subsets have one or more different functionalities.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: An example method includes obtaining annotated source code and based at least in part on a first annotation, separating the source code into first and second source code portions. The method also includes generating from the first source code portion a first source code stream to be supplied for compilation by a first compiler, the first source code stream augmented, based on the first annotation, to include additional coordination code not present in the obtained source code, and the first compiler specific to the first-type subset of the target CPUs. The method further includes generating from the second source code portion a second source code stream to be supplied for compilation by a second compiler, the second compiler specific to a second-type subset of the target CPUs. The target CPUs of the first- and second-type subsets have one or more different functionalities.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A multi-purpose weight lifting type exercising device is disclosed for lifting weights with a cable supported by an upright frame. An exercise beam is pivotally connected for vertical movement to a cross member of the frame, the cross member secured to the frame intermediate the upper and lower end. On the free end of the exercise beam is an adjustable exercise bar which can be employed in a first position for standing military press bar and in a second position as a bench press bar. The exercise beam is secured to a vertically displaceable weight member positioned beneath and secured to the exercise beam. A cable secured at one end to the weight member through the exercise beam extends through a cable guide member secured to the frame. The outer end of the cable is secured either to an exercise bar employed for rowing exercises, shoulder shrugs, etc. or to an extension cable which leads to a leg exercising machine secured to a bench.