Abstract: An electric machine includes a core defining a first axial end, a second axial end opposite the first axial end, and a plurality of slots extending between the first axial end and the second axial end. Windings are wound on the core. The windings include in-slot portions positioned in the plurality of slots and end turn portions positioned on the first axial end and the second axial end. A cooling tube is coupled to the end turn portions of the windings. A heat transfer member extends between the cooling tube and the windings and is in contact with the cooling tube and the windings.

Abstract: A centrifuge includes a rotor configured to receive sample containers; a drive shaft operatively coupled to the rotor; and a motor. The motor includes a housing; a plurality of substantially parallel fins integral with the housing, each fin having a free end spaced from the housing, wherein the free ends of the plurality of fins are disposed in a common cylindrical plane; and a plurality of substantially parallel grooves, each groove disposed between a pair of adjacent fins and having a groove depth defined by a distance between the common cylindrical plane and the housing. Wherein the plurality of grooves includes a first multitude of grooves having a common groove depth and a second multitude of grooves having a groove depth that is not the same as the common groove depth, wherein the first and second multitude of grooves are interleaved.

Abstract: A centrifuge includes a rotor configured to receive sample containers; a drive shaft operatively coupled to the rotor; and a motor. The motor includes a housing; a plurality of substantially parallel fins integral with the housing, each fin having a free end spaced from the housing, wherein the free ends of the plurality of fins are disposed in a common cylindrical plane; and a plurality of substantially parallel grooves, each groove disposed between a pair of adjacent fins and having a groove depth defined by a distance between the common cylindrical plane and the housing. Wherein the plurality of grooves includes a first multitude of grooves having a common groove depth and a second multitude of grooves having a groove depth that is not the same as the common groove depth, wherein the first and second multitude of grooves are interleaved.

Abstract: A passive surface mount part such as a capacitor or a resistor is employed to attach a first substrate to a second substrate, or a semiconductor device to a substrate, for an electrical circuit assembly. Applicable forms of substrates include a printed circuit board such as a motherboard and a daughterboard, and applicable forms of semiconductor devices include an integrated circuit. In an aspect, a low profile attachment is provided forming a planar structure. Space is conserved, signal transmission is provided, and electrical performance is increased. In another aspect, a standoff is defined between the substrates setting the substrates apart a desired distance, compensating for any surface irregularities, increasing thermal separation, and increasing interconnect flexibility. As an application, the standoff defined between the substrates can be utilized for a structure such as optical glass structure to be situated between the substrates for use with an optical circuit assembly.

Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.

Abstract: An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.

Abstract: An object surface characterization system with adaptive lighting control includes a light projector, a light source, a camera, a processor and a memory subsystem. The processor is coupled to the light projector, the light source and the camera, as well as the memory subsystem. The memory subsystem stores code that, when executed by the processor, instructs the processor to perform a number of steps to achieve adaptive lighting control for the system.

Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.

Abstract: An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.

Abstract: An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.

Abstract: An electric motor and motor drive unit assembly includes a motor assembly having a housing and a motor rotatably coupled within the housing. A power distribution bus is coupled to the housing. The power distribution bus is coupled to an end cap of the motor. A plurality of semiconductor switches are coupled to the power distribution bus. The motor and drive assembly further includes a drive assembly having a case coupled to the power distribution bus. The case is electrically isolated from and is in thermal communication with the power distribution bus. The case has a plurality of openings therethrough. An interconnect circuit board is disposed within the case and is electrically coupled to the power distribution bus through the plurality of openings. A system control board is disposed within the case and is electrically coupled to the interconnect board.

Abstract: A solenoid coil attachment mechanism includes a coil assembly with a wire end that projects from the coil assembly and an extending elongated leg that includes a latching mechanism. A carrier has a wall with an opening receiving the leg of the coil assembly and has a wire guide that is funnel shaped, has an open end and receives the end of the wire. A circuit board is attached to the carrier and the wire end is soldered directly to the circuit board.