Patents by Inventor Jeffrey Hendron

Jeffrey Hendron has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
    Publication number: 20060286350
    Abstract: A chemical mechanical polishing pad (104, 400) that includes a polishing layer (108, 420, 500) having a set of primary grooves (124, 408, 516) formed in a polishing surface (110, 428, 520) of the pad. The pad also includes a set of secondary grooves (128, 404, 504) that become selectively active as a function of the wear of the polishing layer from polishing.
    Type: Application
    Filed: May 19, 2006
    Publication date: December 21, 2006
    Inventors: Jeffrey Hendron, Gregory Muldowney
  • CMP pad having a radially alternating groove segment configuration
    Publication number: 20060154574
    Abstract: A polishing pad (104) having an annular polishing track (122) and including a plurality of grooves (148) that each traverse the polishing track. Each groove includes a plurality of flow control segments (CS1-CS3) and at least two discontinuities in slope (D1, D2) located within the polishing track.
    Type: Application
    Filed: May 20, 2005
    Publication date: July 13, 2006
    Inventors: Carolina Elmufdi, Jeffrey Hendron, Gregory Muldowney