Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 ?m or more, diameters of 10 ?m or below, and inter-pillar spacing below 20 ?m. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 ?m or more, diameters of 10 ?m or below, and inter-pillar spacing below 20 ?m. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

Abstract: 3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 ?m or more, diameters of 10 ?m or below, and inter-pillar spacing below 20 ?m. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

Abstract: A method of additive manufacturing that deposits material onto a cathode by transmitting current from an anode array through an electrolyte to the cathode; the method uses feedback to control the manufacturing of successive layers of a part. For example, feedback signals may be a map of current across the anode array; this current map may be processed using morphological analysis or Boolean operations to determine the extent of deposition across the layer. Feedback data may be used to determine when a layer is complete, and to adjust process parameters such as currents and voltages during layer construction. Layer descriptions may be preprocessed to generate maps of desired anode current, to manipulate material density, and to manage features such as overhangs. Feedback signals may also trigger execution of maintenance actions during the build, such as replenishment of anodes or removal of films or bubbles.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: A method of additive manufacturing that deposits material onto a cathode by transmitting current from an anode array through an electrolyte to the cathode; the method uses feedback to control the manufacturing of successive layers of a part. For example, feedback signals may be a map of current across the anode array; this current map may be processed using morphological analysis or Boolean operations to determine the extent of deposition across the layer. Feedback data may be used to determine when a layer is complete, and to adjust process parameters such as currents and voltages during layer construction. Layer descriptions may be preprocessed to generate maps of desired anode current, to manipulate material density, and to manage features such as overhangs. Feedback signals may also trigger execution of maintenance actions during the build, such as replenishment of anodes or removal of films or bubbles.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

Abstract: Briefly, a method and apparatus adjusts the power consumption level of an integrated circuit by dynamically scaling the clock frequency based on the real-time determined power consumption level. In one example, the method and apparatus changes an actual clock frequency of the integrated circuit to an effective clock frequency based on the maximum clock frequency and the difference between the threshold power consumption level and the actual power consumption level of the integrated circuit in the previous sampling interval. In one example, an effective clock frequency of the integrated circuit in the current sampling interval is determined. In one example, the difference between the maximum and effective clock frequencies in the current sampling interval is proportional to the difference between the threshold and actual power consumption levels in the previous sampling interval. The actual clock frequency of the integrated circuit is changed to the determined effective clock frequency.

Abstract: Method for manufacturing a fiber web, in which water is driven out of the fiber web. The method includes displacement dewatering using a clothing arrangement. The clothing arrangement, in the direction of a displacement fluid flow, includes: a membrane; an imprinting fabric, followed by the fiber web; and an anti-rewet fabric. The clothing arrangement is, in the direction of the displacement fluid flow, followed by a roll.

Abstract: A method and apparatus for manufacturing a fiber web, in particular a web of tissue or hygiene material, provided with a three-dimensional surface structure, whereby the fiber web is pressed at a dry content of <35% onto an imprinting fabric by way of a first pressure field and is thereby pre-imprinted and the fiber web is guided through at least one other pressure field, and at least one of dewatering and drying the fiber web.

Abstract: A method and a phase-locked loop (PLL) for generating output clock signals with desired frequencies are described. The PLL is equipped with a ramp generator that increments or decrements a feedback divider value before providing it to a modulator. The modulator modulates the feedback divider value and provides the modulated value to a feedback divider of the PLL for performing frequency division.

Abstract: A permeable belt for use in a system for dewatering and/or drying a fibrous web. The permeable belt capable of being subjected to a tension of at least approximately 30 kN/m, the permeable belt having at least one side having an open area of at least approximately 25% and a contact area of at least approximately 10%.

Abstract: A method and a phase-locked loop (PLL) for generating output clock signals with desired frequencies are described. The PLL is equipped with a ramp generator that increments or decrements a feedback divider value before providing it to a modulator. The modulator modulates the feedback divider value and provides the modulated value to a feedback divider of the PLL for performing frequency division.

Abstract: Briefly, a method and apparatus adjusts the power consumption level of an integrated circuit by dynamically scaling the clock frequency based on the real-time determined power consumption level. In one example, the method and apparatus changes an actual clock frequency of the integrated circuit to an effective clock frequency based on the maximum clock frequency and the difference between the threshold power consumption level and the actual power consumption level of the integrated circuit in the previous sampling interval. In one example, an effective clock frequency of the integrated circuit in the current sampling interval is determined. In one example, the difference between the maximum and effective clock frequencies in the current sampling interval is proportional to the difference between the threshold and actual power consumption levels in the previous sampling interval. The actual clock frequency of the integrated circuit is changed to the determined effective clock frequency.

Abstract: A pressing arrangement including at least one first fabric and second fabric both being permeable. A paper web is disposed between the first fabric and the second fabric. A pressure producing element is in contact with the first fabric. A support surface of a supporting structure is in contact with the second fabric. A differential pressure is provided between the first fabric and the support surface that acts on the first fabric, the paper web, and the second fabric, whereby the paper web is subjected to mechanical pressure and experiences a predetermined hydraulic pressure so as to cause water to be drained from the paper web. The pressing arrangement is structured and arranged to allow air to flow in a direction from the first fabric through the paper web and through the second fabric.

Abstract: A method and system to automate payment for a network-based commerce transaction provide a buyer an option to enable an automatic payment service, wherein automatic payment service automatically provides payment to a seller upon a termination event of a network-based commerce transaction. Payment information of the buyer is provided to a network-based payment system upon the occurrence of the termination event.

Abstract: In an embodiment, an integrated circuit includes an input configured to receive a first control signal and an output module configured to generate an output signal based at least on the first control signal and a second control signal generated based at least on a measured temperature of the IC. The output signal is configured to control a cooling device.